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revision history 1gb auto-a s4c64m16d3 - 96 ball fbga package revision details date rev 1.0 preliminary datasheet june 2015 alliance memory inc. 511 taylor way, san carlos, ca 94070 tel: (650) 610-6800 fax: (650) 620-9211 alliance memory inc. reserves the right to change products or specification without notice 1gb auto-as4c64m16d3 confidential --1/86 rev.1.0 june 2015
features jedec standard compliant power supplies: v dd & v ddq = +1.5 v 0.075 v op erating temperature : -40~1 05c (tc) aec - q100 compliant supports jedec clock jitter specification f ully synchronous operation fast clock rate: 667/800 mhz differential clock, ck & ck # bidirectional di f ferential data strobe - dqs & dqs # 8 internal banks for concurrent operation 8n- bit prefetch architecture pipelined internal architecture precharge & active power down programmable mode & extended mode registers a dditive l atency (al) : 0, cl - 1, cl -2 programmable b urst lengths: 4 , 8 burst type: sequential / interleave output driver impedance control 8192 refresh cycles / 64ms - average refresh period 7.8? @ -40c QtcQ +85 c 3.9 ? @ +85c tcQ+1 0 5c write leveling zq calibration dynamic odt (rtt_nom & rtt_wr) rohs compliant auto refresh and self refresh 96- ball 9 x 13 x 1.2mm fbga p ackage - pb and halogen free table 1. speed grade information speed grade clock frequency cas latency t rcd (ns) t rp (ns) ddr3 - 1600 800 mhz 5 13.75 13.75 table 2 C ordering information for rohs compliant products product part no org temperature max clock as4c6 4m1 6d3-1 2ban 64 m x 16 automotive -40c to 105 c 800 mhz overview the 1gb double-d ata-r ate-3 drams is double data rate architecture to achieve high-s peed operation. it is internally configured as an eight bank dram. the 1gb chip is organized as 8mbit x 16 i/os x 8 bank devices. these synchronous devices achieve high speed double-d ata-r ate transfer rates of up to 1600 mb/sec/pin for general applications. the chip is designed to comply with all key ddr3 dram key features and all of the control and address inputs are synchronized with a pair of externally supplied di fferential clocks. inputs are latched at the cross point of differential clocks (ck rising and ck# falling). all i/os are synchronized with differential dqs pair in a source s ynchronous fashion. these devices operate with a single 1.5v ? 0.075v power supply and are available in bga packages. package 96 -ball fbga 1gb auto-as4c64m16d3 confidential --2/86 rev.1.0 june 2015
figure 1. ball assignment (fbga top view) a b c d e 1 2 3 7 8 9 vddq dq13 vssq vdd vddq dq11 vssq vddq vss vssq dq15 vss dq9 udm dq0 . dq12 vddq udqs# dq14 udqs dq10 dq8 vssq ldm vssq vss vssq vddq vdd vddq f vddq dq2 ldqs dq1 dq3 vssq g vssq dq6 ldqs# vdd vss vssq h vrefdq vddq dq4 dq7 dq5 vddq j nc vss ras# ck vss nc k vdd cas# ck# vdd cke l nc cs# we# a10/ap zq m ba0 ba2 nc vrefca vss n vdd a3 a0 a12/bc# ba1 p a5 a2 a1 a4 vss r vdd a7 a9 a11 a6 odt vss vss vss t reset# nc nc a8 vss nc vdd vdd 1gb auto-as4c64m16d3 confidential --3/86 rev.1.0 june 2015
figure 2 . block diagram ck# cke cs# ras# cas# we# dll clock buffer command decoder column counter address buffer a10/ap a9 a11 a12 ba0 ba1 ba2 ck ldqs ldqs# udqs udqs# dq buffer ldm udm dq15 dq0 ~ odt ~ 8m x 16 cell array (bank #0) row decoder column decoder 8m x 16 cell array (bank #1) row decoder column decoder 8m x 16 cell array (bank #2) row decoder column decoder 8m x 16 cell array (bank #3) row decoder column decoder 8m x 16 cell array (bank #4) row decoder column decoder 8m x 16 cell array (bank #5) row decoder column decoder 8m x 16 cell array (bank #6) row decoder column decoder 8m x 16 cell array (bank #7) row decoder column decoder control signal generator a0 refresh counter data strobe buffer mode register zq cal zqcs zqcl reset# a12/bc# vssq rzq 1gb auto-as4c64m16d3 confidential --4/86 rev.1.0 june 2015
figure 3. state diagram this simplified state diagram is intended to provide an overv iew of the possible state transitions and the c ommands to control them. in particular, situations involving more than one bank, the enabling or disabling of on - die termination, and some other events are not captured in full detail power on automatic sequence command sequence power applied reset procedure initialization reset from any state zqcl zq calibration idle self refresh refreshing sre mrs ref srx zqcl,zqcs active power down activating precharge power down pde pdx act bank activating writing writing reading precharging pdx pde read read read a read a write write read write write a read a pre, prea write a write a pre, prea pre, prea act = active pre = precharge ref = refresh prea = precharge all mrs = mode register set zqcl = zq calibration long read = rd, rds4, rds8 read a = rda, rdas4, rdas8 write = wr, wrs4, wrs8 write a = wra, wras4, wras8 reset = start reset procedure zqcs = zq calibration short pde = enter power-down pdx = exit power-down sre = self-refresh entry srx = self-refresh exit mpr = multi-purpose register reading mrs,mpr, write leveling 1gb auto-as4c64m16d3 confidential --5/86 rev.1.0 june 2015
ball descriptions table 3. ball descriptions symbol type description ck, ck # input differential clock: ck and ck # are driven by the system clock. all sdram input signals are sampled on the crossing of po sitive edge of ck and negative edge of ck#. output (r ead) data is referenced to the crossings of ck and ck# (both directions of crossing). cke input clock enable: cke activates ( high) and deactivates (low ) the ck signal. if cke goes low synchronously with clock, the internal clock is suspended from the next clock cycle and the state of output and burst address is frozen as long as the cke remains low . when all banks are in the idle state, deactivating the clock controls the entry to the power down and self refresh modes. ba0-ba2 input bank address : ba0-ba2 define to which bank the bankactivate, read, write, or bank precharge command is being applied. a0 - a1 2 input address inputs: a0 - a1 2 are sampled during the bankactivate command (row address a0 - a1 2 ) and read/write command (column address a0 -a9 with a10 defining auto precharge ). a10/ap input auto - precharge: a10 is sampled during read/write commands to determine whether autoprecharge should be performed to the accessed bank after the read/write operation. (high: autoprecharge; low: no autoprecharge). a10 is sampled during a precharge command to determine whether the precharge applies to one bank (a10 low) or all banks (a10 high). a12/bc# input burst chop: a12/ bc # is sampled during read and write commands to determine if burst chop (on the fly) will be performed. (high - no burst chop; low - burst chopped). cs # input chip select: cs # enables (sampled low) and disables (sampled high) the command decoder . all commands are masked when cs # is sampled high. it is considered part of the command code. ras # input row address strobe: the ras # signal defines the operation co mmands in conjunction with the cas # and we # signals and is latched at the crossing of positive edges of ck and negative edge of ck# . when ras # and cs # are asserted "low" and cas # is asserte d "high," either the bankactivate command or the precha rge command is selected by the we # signal. when the we # is asserted "high," the bankactivate command is selected and the bank designated by b a is turned on to the active state. when the we # is asserted "low," the precharge command is selected and the bank designated by b a is switched to the idle state after the precharge operation. cas # input column address strobe: the cas # signal defines the operation commands in conjunction with the ras # and we # sign als and is latched at the crossing of positive edges of ck and negative edge of ck# . when ras # is held "high" and cs # is asserted "low," the column access is started by asserting cas # "low." then, the read or write co mmand is selected by asserting we # high " or low ". we # input write enable: the we # signal defines the operation commands in conjunction with the ras # and cas # signals and is latched at the crossing of positive edges of ck and negative edge of ck# . the we # input is used to select the bankacti vate or precharge command and read or write command. ldqs, ldqs # udqs udqs # input / output bidirectional data strobe: specifies timing for input and output data. read data strobe is edge triggered. write data strobe provides a setup and hold time for dat a and dqm. ldqs is for dq0~7, udqs is for dq8~15. the data strobes ldos and udqs are paired with ldqs # and udqs # to provide differential pair signaling to the system during both reads and writes. ldm, udm input data input mask: input data is masked when dm is sampled high during a write cycle. ldm masks dq0 - dq7, udm masks dq8 - dq15. dq0 - dq15 input / output data i/o: the dq0 - dq15 input and output data are synchronized with positive and negative edges of dqs and dqs#. the i/os are byte - maskable during wri tes. 1gb auto-as4c64m16d3 confidential --6/86 rev.1.0 june 2015
odt input on die termination: odt (registered high) enables termination resistance internal to the ddr3 sdram. when enabled, odt is applied to each dq, dqs, dqs# . the odt pin will be ignored if mode - registers, mr1and mr2, are programmed to disable r tt. reset # input active low asynchronous reset: reset is active when reset # is low, and inactive when reset# is high. reset # must be high during normal operation. reset# is a cmos rail to rail signal with dc high and low at 80% and 20% of vdd v dd supply power supply: + 1. 5 v 0.075 v v ss supply ground v ddq supply dq power: + 1. 5 v 0.075 v. v ssq supply dq ground v refca supply reference voltage for ca v refdq supply reference voltage for dq zq supply reference pin for zq calibration. nc - no connect: these pins should be left unconnected. 1gb auto-as4c64m16d3 confidential --7/86 rev.1.0 june 2015
operation mode truth table table 4. truth table (note (1), (2)) command state cke n-1 (3) cke n dm ba0-2 a10 /ap a0 - 9, 11 a12/bc# cs # ras # cas # we # bankactivate idle (4) h h x v row address l l h h single bank precharge any h h x v l v v l l h l all banks precharge any h h x v h v v l l h l write (fixed bl8 or bc4) active (4) h h x v l v v l h l l write (bc4, on the fly) active (4) h h x v l v l l h l l write (bl8, on the fly) active (4) h h x v l v h l h l l write with autoprecharge (fixed bl8 or bc4) active (4) h h x v h v v l h l l write with autoprecharge (bc4, on the fly) active (4) h h x v h v l l h l l write with autoprecharge (bl8, on the fly) active (4) h h x v h v h l h l l read (fixed bl8 or bc4) active (4) h h x v l v v l h l h read (bc4, on the fly) active (4) h h x v l v l l h l h read (bl8, on the fly) active (4) h h x v l v h l h l h read with autoprecharge (fixed bl8 or bc4) active (4) h h x v h v v l h l h read with autopr echarge (bc4, on the fly) active (4) h h x v h v l l h l h read with autoprecharge (bl8, on the fly) active (4) h h x v h v h l h l h ( extended ) mode register set idle h h x v op code l l l l no - operation any h h x v v v v l h h h device deselect any h h x x x x x h x x x burst stop active (5) h x x x x x x l h h l refresh idle h h x v v v v l l l h selfrefresh entry idle h l x v v v v l l l h selfrefresh exit idle l h x x x x x h x x x v v v v l h h h power down mode entry idle h l x x x x x h x x x v v v v l h h h power down mode exit any l h x x x x x h x x x v v v v l h h h data in put mask disable active h x l x x x x x x x x data input mask enable (6) active h x h x x x x x x x x zq calibration long idle h h x x h x x l h h l zq calibration short idle h h x x l x x l h h l n ote 1: v=valid data, x=don't care, l=low level, h=high level note 2: cken signal is input level when commands are provided. note 3 : cken - 1 signal is input level one clock cycle before the commands are pro vided. note 4: these are states of bank designated by b a signal. note 5: device state is 4 , and 8 burst operation. note 6: ldm and udm can be enable d respectively. 1gb auto-as4c64m16d3 confidential --8/86 rev.1.0 june 2015
functional description the ddr3 sdram is a high - speed dynamic random access memory interna lly configured as an eight - bank dram. the ddr3 sdram uses an 8n prefetch architecture to achieve high speed operation. the 8n prefetch architecture is combined with an interface designed to transfer two data words per clock cycle at the i/o pins. a single read or write operation for the ddr3 sdram consists of a single 8n - bit wide, four clock data transfer at the internal dram core and two corresponding n - bit wide, one - half clock cycle data transfers at the i/o pins. read and write operation to the ddr3 sdra m are burst oriented, start at a selected location, and continue for a burst length of eight or a chopped burst of four in a programmed sequence. operation begins with the registration of an active command, which is then followed by a read or write command. the address bits registered coincident with the active command are used to select the bank and row to be activated (ba0 - ba2 select the bank; a0 - a12 select the row). the address bit registered coincident with the read or write command are used to select the starting column location for the burst operation, determine if the auto precharge command is to be issued (via a10), and select bc4 or bl8 mode on the fly (via a12) if enabled in the mode register. prior to normal operation, the ddr3 sdram must be p owered up and initialized in a predefined manner. the following sections provide detailed information covering device reset and initialization, register definition, command descriptions and device operation. figure 4. reset and initialization sequence at power-on ramping ck# vddq tb tc td te tf tg th ti tj ta reset# ck t cksrx tk t=200? t=500? t dllk t xpr t mrd t mrd t mrd t mod t zqinit mrs note 1 mrs mrs mrs zqcl note 1 valid mr3 mr2 mr1 mr0 valid valid vdd command cke ba odt rtt t min =10ns t is t is t is t is static low in case rtt_nom is enabled at time tg, otherwise static high or low don't care time break note 1. from time point "td" until "tk " nop or des commands must be applied between mrs and zqcl commands. 1gb auto-as4c64m16d3 confidential --9/86 rev.1.0 june 2015
l power-up and initialization the following sequence is required for power up and initialization 1. apply power ( reset# is recommended to be maintained below 0.2 x vdd, all other inputs may be undefined). res et# needs to be maintained for minimum 200 u s with stable power. cke is pulled low anytime before reset# being de- asserted (min. time 10ns). the power voltage ramp time between 300mv to vddmin must be no greater than 200ms; and during the ramp, vdd>vddq and (vdd - vddq) <0.3 volts. - vdd and vddq are driven from a single power converter output, and - the voltage levels on all pins other than vdd, vddq, vss, vssq must be less than or equal to vddq and vdd on one side and must be larger than or equal to vssq a nd vss on the other side. in addition, vtt is limited to 0.95v max once power ramp is finished, and - vref tracks vddq/2. or - apply vdd without any slope reversal before or at the same time as vddq. - apply vddq without any slope reversal before or at the same time as vtt & vref. - the voltage levels on all pins other than vdd, vddq, vss, vssq must be less than or equal to vddq and vdd on one side and must be larger than or equal to vssq and vss on the other side. 2. after reset# is de - asserted, wait for another 500us until cke become active. during this time, the dram will start internal state initialization; this will be done independently of external clocks. 3. clock (ck, ck# ) need to be started and stabilized for at least 10ns or 5tck (which is larger) before cke goes active. since cke is a synchronous signal, the corresponding set up time to clock (tis) must be meeting. also a nop or deselect command must be registered (with tis set up time to clock) before cke goes active. once the cke registered ?igh?after reset, cke needs to be continuously registered ?igh?until the initialization sequence is finished, including expiration of tdllk and tzqinit. 4. the ddr3 dram will keep its on - die termination in high impedance state as long as reset# is asserted. further, the dram keeps its on - die termination in high impedance state after reset# deassertion until cke is registered high. the odt input signal may be in undefined state until tis before cke is registered high. when cke is registered high, the odt inpu t signal may be statically held at either low or high. if rtt_nom is to be enabled in mr1, the odt input signal must be statically held low. in all cases, the odt input signal remains static until the power up initialization sequence is finished, including the expiration of tdllk and tzqinit. 5. after cke being registered high, wait minimum of reset cke exit time, txpr, before issuing the first mr s command to load mode register. ( txpr =max (txs, 5tck) ) 6. issue mrs command to load mr2 with all application settings. (to issue mrs command for mr2, provide low to ba0 and ba2, high to ba1) 7. issue mrs c ommand to load mr3 with all application settings. (to issue mrs command for mr3, provide low to ba2, high to ba0 and ba1) 8. issue mrs c ommand to load mr1 with all application settings and dll enabled. (to issue dll enable command, provide low to a0, high to ba0 and low to ba1 and ba2) 9. issue mrs command to load mr0 with all application settings and dll reset. (to issue dll r eset command p rovi de ?igh?to a8 and ?ow?to ba0 - ba2) 10. issue zqcl command to starting zq calibration. 11. wait for both tdllk and tzqinit completed. 12. the ddr3 sdram is now ready for normal operation. 1gb auto-as4c64m16d3 confidential --10/86 rev.1.0 june 2015
l reset procedure at stable power the following se quence is required for reset at no power interruption initialization. 1. asserted reset below 0.2*vdd anytime when reset is needed (all other inputs may be undefined). reset needs to be maintained for minimum 100ns. cke is pulled low before reset bein g d e- asserted (min. time 10ns). 2. follow power - up initialization sequence step 2 to 11. 3. the reset s equence is now completed. ddr3 sdram is ready for normal operation. figure 5. reset procedure at power stable condition ck# vddq tb tc td te tf tg th ti tj ta reset# ck t cksrx tk t=100ns t=500? t dllk t xpr t mrd t mrd t mrd t mod t zqinit mrs note 1 mrs mrs mrs zqcl note 1 valid mr3 mr2 mr1 mr0 valid valid vdd command cke ba odt rtt t is t is t is t is static low in case rtt_nom is enabled at time tg, otherwise static high or low don't care time break note 1. from time point "td" until "tk" nop or des commands must be applied between mrs and zqcl commands. t min =10ns 1gb auto-as4c64m16d3 confidential --11/86 rev.1.0 june 2015
register definition l programming the mode registers for application flexibility, various functions, features, and modes are programmable in four mode registers, provided by the ddr3 sdram, as user defined variables and they must be programmed via a mode regis ter set (mrs) command. as the default values of the mode registers are not defined, contents of mode registers must be fully initialized and/or re - initialized, i.e. , written, after power up and/or reset for proper operation. also the contents of the mode r egisters can be altered by re - executing the mrs command during normal operation. when programming the mode registers, even if the user chooses to modify only a sub - set of the mrs fields, all address fields within the accessed mode register must be redefine d when the mrs command is issued. mrs command and dll reset do not affect array contents, which mean these commands can be executed any time after power - up without affecting the array contents. the mode register set command cycle time, tmrd is required to complete the write operation to the mode register and is the minimum time required between two mrs commands shown in figure of tmrd timing. figure 6. tmrd timing t1 t2 ta0 ta1 tb0 tb1 tb2 tc0 tc1 t0 tc2 valid t mrd odtloff + 1 don't care time break valid valid valid mrs nop/des nop/des mrs nop/des nop/des valid valid valid valid valid valid valid valid valid valid valid valid valid old settings updating settings valid valid valid valid valid valid valid valid valid valid valid valid valid t mod new settings rtt_nom enabled prior and/or after mrs command rtt_nom disabled prior and after mrs command ck# address ck command cke settings odt odt 1gb auto-as4c64m16d3 confidential --12/86 rev.1.0 june 2015
the mrs command to non - mrs command delay, tmod, is require f or the dram to update the features except dll reset, and is the minimum time required from an mrs command to a non - mrs command excluding nop and des shown in figure of tmod timing. figure 7. tmod timing ck# t1 t2 ta0 ta1 ta2 ta3 ta4 tb0 tb1 t0 address ck tb2 valid command cke settings odt odt odtloff + 1 don't care time break valid valid valid mrs nop/des nop/des nop/des nop/des nop/des valid valid valid valid valid valid valid valid valid valid valid valid valid old settings updating settings valid valid valid valid valid valid valid valid valid valid valid valid valid t mod new settings rtt_nom enabled prior and/or after mrs command rtt_nom disabled prior and after mrs command the mode register con tents can be changed using the same command and timing requirements during normal operation as long as the dram is in idle state, i.e. , all banks are in the precharged state with trp satisfied, all data bursts are completed and cke is high prior to writing into the mode register. the mode registers are divided into various fields depending on the functionality and/or modes. 1gb auto-as4c64m16d3 confidential --13/86 rev.1.0 june 2015
l mode register mr0 the mode - register mr0 stores data for controlling various operating modes of ddr3 sdram. it controls burst lengt h, read burst type, cas latency, test mode, dll reset, wr, and dll control for precharge power - down, which include various vendor specific options to make ddr3 dram useful for various applications. the mode register is written by asserting low on cs#, ras# , cas#, we#, ba0, ba1, and ba2, while controlling the states of address pins according to the following figure. table 5. mode register bitmap b a2 ba1 b a0 a12 a11 a10 a9 a8 a7 a6 a5 a4 a3 a2 a1 a0 address field 0 *1 0 0 ppd wr dll tm cas latency rbt 0 *1 bl mode register (0) ba1 ba0 mrs mode a7 mode a3 read burst type a1 a0 bl 0 0 mr0 0 normal 0 nibble sequential 0 0 8 (fixed) 0 1 mr1 1 test 1 interleave 0 1 bc4 or 8 (on the fly) 1 0 mr2 1 0 bc4 (fixed) 1 1 mr3 1 1 reserved a11 a10 a9 wr (cycles) a6 a5 a4 cas latency 0 0 0 16 *2 0 0 1 5 *2 0 0 0 reserved 0 1 0 6 *2 0 0 1 5 0 1 1 7 *2 0 1 0 6 1 0 0 8 *2 0 1 1 7 1 0 1 10 *2 1 0 0 8 1 1 0 12 *2 1 0 1 9 1 1 1 14 *2 1 1 0 10 1 1 1 11 a12 dll control for precharge pd 0 slow exit (dll off) a8 dll reset 1 fast exit (dll on) 0 no 1 yes note 1: ba2 and a2 are reserved for future use and must be set to 0 when program ming the mr. note 2: wr (write recovery for autoprecharge) min in clock cycles is calculated by dividing twr ( ns) by tck ( ns) and rounding up to the next integer wr min [cycles] =roundup (twr / tck). the value in the mode register must be programmed to be equal or larger than wrmin. the programmed wr value is used with trp to determine tdal. 1gb auto-as4c64m16d3 confidential --14/86 rev.1.0 june 2015
- burst length, type, and order accesses within a given burst may be programmed to sequential or interleaved order. the burst type is selected via bit a3 as shown in the mr0 definition as above figure. the ordering of access within a burst is determined by the burst length, burst type, and the starting column address. the burst length is defined by bits a0 - a1. burst lengths options include fix bc4, fixed bl8, and on t he fly which allow bc4 or bl8 to be selected coincident with the registration of a read or write command via a12/ bc# table 6. burst type and burst order burst length read write starting column address sequential a3=0 interleave a3=1 note a2 a1 a0 4 chop read 0 0 0 0, 1, 2, 3, t, t, t, t 0, 1, 2, 3, t, t, t, t 1, 2, 3 0 0 1 1, 2, 3, 0, t, t, t, t 1, 0, 3, 2, t, t, t, t 0 1 0 2, 3, 0, 1, t, t, t, t 2, 3, 0, 1, t, t, t, t 0 1 1 3, 0, 1, 2, t, t, t, t 3, 2, 1, 0, t, t, t, t 1 0 0 4, 5, 6, 7, t, t, t, t 4, 5, 6, 7, t, t, t, t 1 0 1 5, 6, 7, 4, t, t, t, t 5, 4, 7, 6, t, t, t, t 1 1 0 6, 7, 4, 5, t, t, t, t 6, 7, 4, 5, t, t, t, t 1 1 1 7, 4, 5, 6, t, t, t, t 7, 6, 5, 4, t, t, t, t write 0 v v 0, 1, 2, 3, x, x, x, x 0, 1, 2 , 3, x, x, x, x 1, 2, 4, 5 1 v v 4, 5, 6, 7, x, x, x, x 4, 5, 6, 7, x, x, x, x 8 read 0 0 0 0, 1, 2, 3, 4, 5, 6, 7 0, 1, 2, 3, 4, 5, 6, 7 2 0 0 1 1, 2, 3, 0, 5, 6, 7, 4 1, 0, 3, 2, 5, 4, 7, 6 0 1 0 2, 3, 0, 1, 6, 7, 4, 5 2, 3, 0, 1, 6, 7, 4, 5 0 1 1 3, 0, 1, 2, 7, 4, 5, 6 3, 2, 1, 0, 7, 6, 5, 4 1 0 0 4, 5, 6, 7, 0, 1, 2, 3 4, 5, 6, 7, 0, 1, 2, 3 1 0 1 5, 6, 7, 4, 1, 2, 3, 0 5, 4, 7, 6, 1, 0, 3, 2 1 1 0 6, 7, 4, 5, 2, 3, 0, 1 6, 7, 4, 5, 2, 3, 0, 1 1 1 1 7, 4, 5, 6, 3, 0, 1, 2 7, 6, 5, 4, 3, 2, 1, 0 write v v v 0, 1, 2, 3, 4, 5, 6, 7 0, 1, 2, 3, 4, 5, 6, 7 2, 4 note 1: in case of burst length being fixed to 4 by mr0 setting, the internal write operation starts two clock cycles earlier than for the bl8 mode. this means that the starting point for twr and twtr will be pulled in by two clocks. in case of burst length being selected on - the - fly via a12/bc#, the internal write operation starts at the same point in time like a burst of 8 write operation. this means that during on -t he- fly control, the starting point for twr and twtr will not be pulled in by two clocks. note 2: 0~ 7 bit number is value of ca[2:0] that causes this bit to be the first read during a burst. note 3: t: output driver for data and strobes are in high impeda nce . note 4: v: a valid logic level (0 or 1), but respective buffer input ignores level on input pins. note 5: x: dont care. - cas latency the cas latency is defined by mr0 (bit a 2, a4 ~a 6 ) as shown in the mr0 definition figure. cas latency is the delay , in clock cycles, between the internal read command and the availability of the first bit of output data. ddr3 sdram does not su pport any half clock latencies. the overall read latency (rl) is defined as additive latency (al) + cas latency (cl); rl = al + cl. - test mode the normal operating mode is selected by mr0 (bit7=0) and all other bits set to the desired values shown in the mr0 definition figure. programming bit a7 to a 1 places the ddr3 sdram into a test mode that is only used by the dram manufa cturer and should not be used. no operations or functionality is guaranteed if a7=1. - dll reset the dll reset bit is self - clearing, meaning it returns back to the value of 0 after the dll reset function has been issued. once the dll is enabled, a subse quent dll reset should be applied. anytime the dll reset function is used, tdllk must be met before any functions that require the dll can be used (i.e. read commands or odt synchronous operations.) 1gb auto-as4c64m16d3 confidential --15/86 rev.1.0 june 2015
- write recovery the programmed wr value mr0 (bits a9, a10, and a11) is used for the auto precharge feature along with trp to determine tdal. wr (write recovery for auto - precharge) min in clock cycles is calculated by dividing twr (ns) by tck (ns) and rounding up to the next integer: wr min [cycles] = roundup (twr [ns]/tck [ns]). the wr must be programmed to be equal or larger than twr (min). - precharge pd dll mr0 (bit a12) is used to select the dll usage during precharge power - down mode. when mr0 (a12=0), or ?low - exit, the dll is frozen after entering prec harge power - down (for potential power savings) and upon exit requires txpdll to be met prior to the next valid command. when mr0 (a12=1), or fast - exit, the dll is maintained after entering precharge power - down and upon exiting power - down requires txp to be met prior to the next valid command. l mode register mr1 the mode register mr1 stores the data for enabling or disabling the dll, output strength, rtt_nom impedance, additive latency, write leveling enable and qoff. the mode register 1 is written by asse rting low on cs# , ras# , cas# , we#, high on ba0 and low on ba1 and ba2, while controlling the states of address pins according to the following figure. table 7. extended mode register emr (1) bitmap b a2 ba1 b a0 a12 a11 a10 a9 a8 a7 a6 a5 a4 a3 a2 a1 a0 ad dress field 0 *1 0 1 qoff 0 *1 0 *1 rtt_no m 0 *1 level rtt_no m d.i.c al rtt_no m d.i.c dll mode register (1) ba1 ba0 mrs mode a4 a3 additive latency a0 dll enable 0 0 mr0 0 0 0 (al disabled) 0 enable 0 1 mr1 0 1 c l 1 1 disable 1 0 mr 2 1 0 cl 2 1 1 mr 3 1 1 reserved a12 qoff *2 a9 a6 a2 rtt_nom *3 0 output buffer enabled 1 o utput buffer disabled 0 0 0 rtt_nom disabled 0 0 1 rzq/4 a7 write leveling enable 0 1 0 rzq/2 0 disabled 0 1 1 rzq/6 1 enabled 1 0 0 rzq/12 *4 note: rzq = 240 1 0 1 rzq/8 *4 a5 a1 output driver impedance control 1 1 0 reserved 0 0 rzq/6 1 1 1 reserved 0 1 rzq/7 note: rzq = 240 1 0 reserved 1 1 reserved note 1: ba2 and a8, a10 ~ a11 are rfu and must be programmed to 0 during mrs . note 2: outputs disabled - dqs, dqss, dqs#s. note 3: in write leveling mode (mr1 [bit7] = 1) with mr1 [bit12] =1, all rtt_nom s ettings are allowed; in write leveling mode (mr1 [bit7] = 1) with mr1 [bit12]=0, only rtt_nom settings of rzq/2, rzq/4 and rzq/6 are allowed. note 4: if rtt_nom is used during writes, only the values rzq/2, rzq/4 and rzq/6 are allowed. 1gb auto-as4c64m16d3 confidential --16/86 rev.1.0 june 2015
- dll enable/disable the dll must be enabled for normal operation. dll enable is required during power up initialization, and upon returning to normal operation after having the dll disabled. during normal operation (dll - on) with mr1 (a0=0), the dll is automatically disabled when entering self - refresh operation and is automatically re - enable upon exit of self - refresh operation. any time the dll is enabled and subsequently reset, tdllk clock cycles must occur before a read or synchronous odt command can be issued to allow time for the internal clock to be synchronized with the external clock. failing to wait for synchronization to occur may resul t in a violation of the tdqsck, taon, or taof parameters. during tdllk, cke must continuously be registered high. ddr3 sdram does not require dll for any write operation, expect when rtt_wr is enabled and the dll is required for proper odt operation. for more detailed information on dll disable operation are described in dll - off mode. the direct odt feature is not supported during dll - off mode. the on - die termination resistors must be disabled by continuously registering the odt pin low and/or by programmin g the rtt_nom bits mr1{a9,a6,a2} to {0,0,0} via a mode register set command during dll - off mode. the dynamic odt feature is not supported at dll - off mode. user must use mrs command to set rtt_wr, mr2 {a10, a9} = {0, 0}, to disable dynamic odt externally - output driver impedance control the outpu t driver impedance of the ddr3 sdram device is selected by mr1 (bit a1 and a5) as shown in mr1 definition figure. - odt rtt values ddr3 sdram is capable of providing two different termination values (rtt_nom and r tt_wr). the nominal termination value rtt_nom is programmable in mr1. a separate value (rtt_wr) may be programmable in mr2 to enable a unique rtt value when odt is enabled during writes. the rtt_wr value can be applied during writes even when rtt_nom is di sabled. - additive latency (al) additive latency (al) operation is supported to make command and data bus efficient for sustainable bandwidth in ddr3 sdram. in this operation, the ddr3 sdram allows a read or write command (either with or without auto - precharge) to be issued immediately after the active command. the command is held for the time of the additive latency (al) before it is issued inside the device. the read latency (rl) is controlled by the sum of the al and cas latency (cl) register settings. write latency (wl) is controlled by the sum of the al and cas write latency (cwl) register settings. a summary of the al register options are shown in mr. - write leveling for better signal integrity, ddr3 memory module adopted fly - by topology for the com mands, addresses, control signals, and clocks. the fly - by topology has benefits from reducing number of stubs and their length but in other aspect, causes flight time skew between clock and strobe at every dram on dimm. it makes difficult for the controlle r to maintain tdqss, tdss, and tdsh specification. therefore, the controller should support write leveling in ddr3 sdram to compensate for skew. - output disable the ddr3 sdram outputs maybe enable/disabled by mr1 (bit 12) as shown in mr1 definition. when this feature is enabled (a12=1) all output pins (dqs, dqs, dqs# , etc.) are disconnected from the device removing any loading of the output drivers. this feature may be useful when measuring modules power for example. for normal operation a12 should be set to 0. 1gb auto-as4c64m16d3 confidential --17/86 rev.1.0 june 2015
l mode register mr2 the mode register mr2 stores the data for controlling refresh related features, rtt_wr impedance, and cas write latency. the mode register 2 is written by asserting low on cs# , ras# , cas# , we#, high on ba1 and low on ba0 and ba2, while controlling the states of address pins according to the table below. table 8. extended mode register emr (2) bitmap b a2 ba1 b a0 a12 a11 a10 a9 a8 a7 a6 a5 a4 a3 a2 a1 a0 address field 0 *1 1 0 0 *1 rtt_wr 0 *1 srt asr cw l pasr mode register (2) ba1 ba0 mrs mode a6 auto self - refresh (asr) 0 0 mr0 0 manual sr reference (srt) 0 1 mr 1 1 asr enable (optional) 1 0 mr2 1 1 mr3 a10 a9 rtt_wr *2 a2 a1 a0 partial arra y self - refresh (optional) 0 0 dynamic odt off (write does not affect rtt value) 0 1 rzq/4 0 0 0 full array 1 0 rzq/2 0 0 1 halfarray (ba[2:0]=000,001,010,&011) 1 1 reserved 0 1 0 quarter array (ba[2:0]=000,&001) 0 1 1 1/8 th array (ba[2:0]=000) 1 0 0 3/4 array (ba[2:0]=010,011,100.101,110,&111) 1 0 1 halfarray (ba[2:0]=100,101,110,&111) 1 1 0 quarter array (ba[2:0]=110,&111) 1 1 1 1/8 th array (ba[2:0]=111) a7 self - refresh temperat ure (srt) range a5 a4 a3 cas write latency (cwl) 0 normal operating temperature range 0 0 0 5 (tck(avg) R 2.5ns) 1 extended (optional) operating temperature range 0 0 1 6 (2.5ns tck(avg) R 1.875ns) 0 1 0 7 (1.875ns tck(avg) R 1.5ns) 0 1 1 8 (1.5ns tck(avg) R 1.25ns) 1 0 0 reserved 1 0 1 reserved 1 1 0 reserved 1 1 1 reserved note 1: ba2 and a8, a 11~ a1 2 are rfu and must be programmed to 0 during mrs . note 2: the rtt_wr value can be applied during writes even when rtt_nom is disabled. during write leveling, dynamic odt is not available. 1gb auto-as4c64m16d3 confidential --18/86 rev.1.0 june 2015
- partial array self-refresh (pasr) optional in ddr3 sdram: users should refer to the dram supplier data sheet and/or the dimm spd to determine if ddr3 sdram devices support the following options or requirements referred to in this material. if pasr (partial array self - refresh) is enabled, data located in areas of the array beyond the specified address range will be lost if self - refresh is entered. data integrity will b e maintained if trefi conditions are met and no self - refresh command is issued. - cas write latency (cwl) the cas write latency is defined by mr2 (bits a3 - a5) shown in mr2. cas write latency is the delay, in clock cycles, between the internal write command and the availability of the first bit of input data. ddr3 dram does not support any half clock latencies. the overall write latency (wl) is defined as additive latency (al) + cas write latency (cwl); wl=al+cwl. for more information on the supported cwl a nd al settings based on the operating clock frequency, refer to ?tandard speed bins. for detailed write operation refer to write operation. - auto self-refresh (asr) and self-refresh temperature (srt) ddr3 sdram must support self - refresh operation at all supported temperatures. applications requiring self - refresh operation in the extended temperature range must use the asr function or program the srt bit appropriately. optional in ddr3 sdram: users should refer to the dram supplier data sheet and/or t he dimm spd to determine if ddr3 sdram devices support the following options or requirements referred to in this material. for more details refer to ?xtended temperature usage? ddr3 sdrams must support self - refresh operation at all supported temperatures. applications requiring self - refresh operation in the extended temperature range must use the optional asr function or program the srt bit appropriately. - dynamic odt (rtt_wr) ddr3 sdram introduces a new feature dynamic odt. in certain application cas es and to further enhance signal integrity on the data bus, it is desirable that the termination strength of the ddr3 sdram can be changed without issuing an mrs command. mr2 register locations a9 and a10 configure the dynamic odt settings. ddr3 sdram int roduces a new feature ?ynamic odt? in certain application cases and to further enhance signal integrity on the data bus, it is desirable that the termination strength of the ddr3 sdram can be changed without issuing an mrs command. mr2 register locations a9 and a10 configure the dynamic odt settings. in write leveling mode, only rtt_nom is available. for details on dynamic odt operation, refer to ?ynamic odt? 1gb auto-as4c64m16d3 confidential --19/86 rev.1.0 june 2015
l mode register mr3 the mode register mr3 controls multi - purpose registers. the mode register 3 is written by asserting low on cs# , ras# , cas# , we# , high on ba1 and ba0, and low on ba2 while controlling the states of address pins according to the table below table 9. extended mode register emr (3) bitmap b a2 ba1 b a0 a12 a11 a10 a9 a8 a7 a6 a5 a4 a3 a2 a1 a0 address field 0 *1 1 1 0 *1 mpr mpr loc mode register (3) ba1 ba0 mrs mode a2 mpr a1 a0 mpr location 0 0 mr0 0 normal operation *3 0 0 predefined pattern *2 0 1 mr1 1 dataflow from mpr 0 1 rfu 1 0 mr2 1 0 rfu 1 1 mr3 1 1 rfu note 1: ba2, a3 - a1 2 are rfu and must be programmed to 0 during mrs. note 2: the predefined pattern will be used for read synchronization. note 3: when mpr control is set for no rmal operation (mr3 a [2] = 0) then mr3 a[1:0] will be ignored. 1gb auto-as4c64m16d3 confidential --20/86 rev.1.0 june 2015
table 10. absolute maximum dc ratings symbol parameter values unit note v dd voltage on vdd pin relative to vss - 0.4 ~ 1. 8 v 1,3 v ddq voltage on vddq pin relative to vss - 0. 4 ~ 1. 8 v 1,3 v in , v out voltage on any pin relative to vss - 0.4 ~ 1. 8 v 1 t stg storage t emperature - 55~1 00 c 1 ,2 n ote1 : stresses greater than those listed under "absolute maximum ratings" may cause permanent damage to the device.this is a st ress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect reliability. note2: storage temperature is the case surface temperature on the center/top side of the dram. note3: vdd and vddq must be within 300mv of each other at all times; and vref must be not greater than 0.6vddq, when vdd and vddq are less than 500mv; vref may be equal to or less than 300mv. table 1 1. temperature range symbol parameter values unit note t oper automotive temperature range - 40~ 10 5 c 1-4 n ote 1: operating temperature is the case surface temperature on center/top of the dram. note2: the operating temperatu r e range is the temperature where all dram specification will be supported. outside of this temperature range, even if it is still within the limit of stress condition, some deviation on portion of operating spe cification may be required. during operation, the dram case temperature must be maintained between 0- 85 c under all other specification parameter. supporting 0 - 85 c with full jedec ac & dc specifications. note3: some applications require operation of the dram in the extended temperature range between 85 c and 95 c case temperature. full specifications are guaranteed in this range, but the following additional apply. a) refresh commands must be doubled in frequency, therefore, reducing the refresh interval trefi to 3.9us. it is also possible to specify a component with 1x refresh (trefi to 7.8us) in the extended temperature range. b) if self - refresh oper ation is required in the extended temperature range, then it is mandatory to either use the manual self - refresh mode with extended temperature range capability (mr2 a6=0 and mr2 a7=1) or enable the optional auto self - ref resh mode (mr2 a6=1 and mr2 a7=0). note 4 : duri ng automotive temperature ope ration range, the dram case temperature must be maintained between - 40c~105c under all operating conditions. table 12. recommended dc operating conditions symbol parameter min. typ. max. unit note v dd power s upply v oltage 1.425 1. 5 1.575 v 1,2 v ddq power s upply v oltage for output 1.425 1. 5 1.575 v 1,2 note1 : under all conditions vddq must be less than or equal to vdd. note2 : vddq tracks with vdd. ac parameters are measured wi th vdd and vddq tied together. 1gb auto-as4c64m16d3 confidential --21/86 rev.1.0 june 2015
table 13. single-ended ac and dc input levels for command and address symbol parameter - 12 unit note min. max. v ih .ca(dc100) dc input logic high v ref +0.1 v dd v 1,5 v il .ca(dc100) dc input logic lo w v ss v ref - 0.1 v 1,6 v ih .ca(ac175) ac input logic high v ref +0.175 - v 1,2 v il .ca(ac175) ac input logic low - v ref - 0.175 v 1,2 v ih .ca(ac150) ac input logic high v ref +0.15 - v 1,2 v il .ca(ac150) ac input logic low - v ref - 0.15 v 1,2 v refca (dc) r eference voltage for add, cmd inputs 0.49xv dd 0.51xv dd v 3,4 note 1 : for input only pins except reset#. vref = vrefca(dc). note 2 : see overshoot and undershoot specifications . note 3 : the ac peak noise on vref may not allow vref to deviate from vrefca(dc) by more than +/ - 1% vdd . not e 4 : for reference: approx. vdd/2 +/ - 15 mv. note 5 : vih(dc) is used as a simplified symbol for vih.ca(dc100) note 6 : vil(dc) is used as a simplified symbol for vil.ca(dc100) note 7 : vih(ac) is used as a simplified symbol for vih.ca(ac175), vih.ca(ac150) a nd vih.ca(ac175) value is used when vref + 0.175v is referenced, vih.ca(ac150) value is used when vref + 0.150v is referenced . note 8 : vil(ac) is used as a simplified symbol for vil.ca(ac175), vil.ca(ac150) and vil.ca(ac175) value is used when vref - 0.175 v is referenced, vil.ca(ac150) value is used when vref - 0.150v is referenced . table 14. single-ended ac and dc input levels for dq and dm symbol parameter - 12 unit note min. max. v ih . dq (dc100) dc input logic high v ref +0.1 v dd v 1,5 v il . dq (dc100) dc input logic lo w v ss v ref - 0.1 v 1,6 v ih . dq (ac150) ac input logic high v ref +0.15 - v 1,2 v il . dq (ac150) ac input logic low - v ref - 0.15 v 1,2 v refdq (dc) r eference voltage for dq, dm inputs 0.49xv dd 0.51xv dd v 3,4 note 1 : vref = vrefdq(dc). note 2 : see ?vershoot and undershoot specifications? note 3 : the ac peak noise on vref may not allow vref to deviate from vrefdq(dc) by more than +/ - 1% vdd . note 4 : for reference: approx. vdd/2 +/ - 15 mv. note 5 : vih(dc) is used as a simplified symbol for vih.dq(dc1 00) note 6 : vil(dc) is used as a simplified symbol for vil.dq(dc100) note 7 : vih(ac) is used as a simplified symbol for vih.dq(ac1 50 ) and vih.dq(ac1 50 ) value is used when vref + 0.1 50 v is referenced . note 8 : vil(ac) is used as a simplified symbol for vil.d q(ac1 50 ) and vil.dq(ac1 50 ) value is used when vref - 0.150 v is referenced . 1gb auto-as4c64m16d3 confidential --22/86 rev.1.0 june 2015
table 15. differential ac and dc input levels symbol parameter - 12 unit note min. max. v ih diff differential input high + 0.2 note 3 v 1 v il diff differential input logic lo w note 3 - 0.2 v 1 v ih diff(ac) differential input high ac 2 x (v ih (ac) - v ref ) notes 3 v 2 v il diff(ac) differential input low ac note 3 2 x (v il (ac) - v ref ) v 2 note 1 : used to define a differential signal slew - rate. note 2 : for ck - ck# use vih/vil(ac) of add/cmd and vrefca; for dqsl, dqsl#, dqsu, dqsu# use vih/vil(ac) of dqs and vrefdq; if a reduced ac - high or ac - low level is used for a signal group, then the reduced level applies also here. note 3 : these values are not defined; however, the single - ended signals ck, ck#, dqsl, dqsl#, dqsu, dqsu# need to be within the respective limits (vih(dc) max, vil(dc)min) for single - ended signals as well as the limitations for overshoot and undershoot. table 16. capacitance (v dd = 1. 5 v, f = 1mhz, t oper = 25 c) symbol parameter ddr3 - 1600 unit note min. max . c io input/output capacitance , (dq, dm, dqs, dqs#) 1.5 2.3 pf 1, 2, 3 c ck input capacitance, ck and ck# 0.8 1.4 pf 2, 3 c dck input capacitance delta, ck and ck# 0 0.15 pf 2, 3, 4 c ddqs input/output c apacitance delta , dqs and dqs# 0 0.15 pf 2, 3, 5 c i input capacitance, (ctrl, add, cmd input - only pins) 0.75 1.3 pf 2, 3, 6 c di_ctrl input capacitance delta, (all ctrl input - only pins ) - 0.4 0.2 pf 2, 3, 7, 8 c di_add_cmd input capacitance delta, (all add , cmd input - only pins) - 0.4 0.4 pf 2, 3, 9, 10 c dio input/output capacitance delta, ( dq, dm, dqs, dqs# ) - 0.5 0.3 pf 2, 3, 11 c zq input/output capacitance of zq pin - 3 pf 2, 3, 12 note 1 : although the dm pins have different functions, the loading matches dq and dqs . note 2 : this parameter is not subject to production test. it is verified by design and characterization. vdd=vddq=1.5v, vbias=vdd/2 and ondie termination off. note 3 : this parameter applies to monolithic devices only; stacked/dual - die de vices are not covered here . note 4 : absolute value of cck - cck# . note 5 : absolute value of cio(dqs) - cio(dqs#) . note 6 : ci applies to odt, cs#, cke, a0 - a1 2 , ba0 - ba2, ras#, cas#, we#. note 7 : cdi_ctrl applies to odt, cs# and cke . note 8 : cdi_ctrl=ci(ctrl) - 0.5 *(ci(ck)+ci(c k#)) . note 9 : cdi_add_cmd applies to a0 - a1 2 , ba0 - ba2, ras#, cas# and we# . note 10 : cdi_ add_cmd=ci(add_cmd) - 0.5*(ci(ck)+ci(c k#)) . note 11 : cdio=cio(dq,dm) - 0.5*(cio(dqs)+cio(dqs#)) . note 12 : maximum external load capacitance on zq pin: 5 pf. 1gb auto-as4c64m16d3 confidential --23/86 rev.1.0 june 2015
table 17 . idd specification parameters and test conditions (v dd = 1.5 v 0.075 v, t oper = -4 0~10 5 c) parameter & test condition symbol - 12 unit max. operating one bank active - precharge current cke: high; external clock: on; bl: 8 *1 ; al: 0; cs# : hi gh between act and pre; command, address, bank address inputs: partially toggling; data io: mid - level; dm :stable at 0; bank activity: cycling with one bank active at a time: 0,0,1,1,2,2,...; output buffer and rtt: enabled in mode registers *2 ; odt signal: st able at 0 . i dd0 59 ma operating one bank active - read - precharge current cke: high; external clock: on; bl: 8 *1, 7 ; al: 0; cs# : high between act, rd and pre; command, address, bank address inputs, data io: partially toggling; dm :stable at 0; bank activity: c ycling with one bank active at a time: 0,0,1,1,2,2,...; output buffer and rtt: enabled in mode registers *2 ; odt signal: stable at 0 . i dd1 78 ma precharge standby current cke : high; external clock: on; bl: 8 *1 ; al: 0; cs# : stable at 1; command, address, ba nk address inputs: partially toggling; data io: mid - level; dm :stable at 0; bank activity: all banks closed; output buffer and rtt: enabled in mode registers *2 ; odt signal: stable at 0 . i dd2n 29 ma precharge power - down current slow exit cke: low; external clock: on; bl: 8 *1 ; al: 0; cs# : stable at 1; command, address, bank address inputs: stable at 0; data io: mid - level; dm :stable at 0; bank activity: all banks closed; output buffer and rtt: enabled in mode registers *2 ; odt signal: stable at 0; pecharge powe r down mode : slow exit . *3 i dd2p0 14 ma precharge power - down current fast exit cke: low; external clock: on; bl: 8 *1 ; al: 0; cs# : stable at 1; command, address, bank address inputs: stable at 0; data io: mid - level; dm :stable at 0; bank activity: all banks closed; output buffer and rtt: enabled in mode registers *2 ; odt signal: stable at 0; pecharge power down mode : fast exit . *3 i dd2p1 16 ma precharge quiet standby current cke : high; external clock: on; bl: 8 *1 ; al: 0; cs# : stable at 1; command, address, ban k address inputs: stable at 0; data io: mid - level; dm :stable at 0; bank activity: all banks closed; output buffer and rtt: enabled in mode registers *2 ; odt signal: stable at 0 . i dd2q 23 ma active standby current cke : high; external clock: on; bl: 8 *1 ; al: 0; cs# : stable at 1; command, address, bank address inputs: partially toggling; data io: mid - level; dm :stable at 0; bank activity: all banks open; output buffer and rtt: enabled in mode registers *2 ; odt signal: stable at 0 . i dd3n 34 ma active power - down cu rrent cke: low; external clock: on; bl: 8 *1 ; al: 0; cs# : stable at 1; command, address, bank address inputs: stable at 0; data io: mid - level; dm :stable at 0; bank activity: all banks open; output buffer and rtt: enabled in mode registers *2 ; odt signal: stab le at 0 i dd3p 22 ma operating burst read current cke: high; external clock: on; bl: 8 *1, 7 ; al: 0; cs# : high between rd; command, address, bank address inputs: partially toggling; dm :stable at 0; bank activity: all banks open, rd commands cycling through banks: 0,0,1,1,2,2,... ; tput buffer and rtt: enabled in mode registers *2 ; odt signal: stable at 0 . i dd4r 168 ma operating burst write current cke: high; external clock: on; bl: 8 *1 ; al: 0; cs# : high between wr; command, address, bank address inputs: partially toggling; dm: stable at 0; bank activity: all banks open . output buffer and rtt: enabled in mode registers *2 ; odt signal: stable at high . i dd4w 168 ma 1gb auto-as4c64m16d3 confidential --24/86 rev.1.0 june 2015
burst refresh current cke: high; external clock: on; bl: 8 *1 ; al: 0; cs# : high between t ref; com mand, address, bank address inputs: partially toggling; data io: mid - level; dm :stable at 0; bank activity: ref command every t rfc; output buffer and rtt: enabled in mode registers *2 ; odt signal: stable at 0 . i dd5b 114 ma self refresh current: auto self - re fresh (asr) : disabled *4 ; self - refresh temperature range (srt): normal *5 ; cke: low; external clock: off; ck and ck#: low; bl: 8 *1 ; al: 0; cs#, command, address, bank address, data io: mid - level; dm :stable at 0; bank activity: self - refresh operation; output b uffer and rtt: enabled in mode registers *2 ; odt signal: mid - level i dd6 24 ma operating bank interleave read current cke: high; external clock: on; bl: 8 *1, 7 ; al: cl - 1; cs# : high between act and rda; command, address, bank address inputs: partially toggling; dm :stable at 0; output buffer and rtt: enabled in mode registers *2 ; odt signal: stable at 0 . i dd7 240 ma reset low current reset: low; external clock: off; ck and ck#: low; cke: floating; cs# , command, address, bank address, data io: floating; odt sig nal: floating reset low current reading is valid once power is stable and reset has been low for at least 1ms. i dd8 14 ma note 1 : burst length: bl8 fixed by mrs: set mr0 a[1,0]=00b note 2 : output buffer enable: set mr1 a[12] = 0b; set mr1 a[5,1] = 01b; rt t_nom enable: set mr1 a[9,6,2] = 011b; rtt_wr enable: set mr2 a[10,9] = 10b note 3 : pecharge power down mode: set mr0 a12=0b for slow exit or mr0 a12=1b for fast exit note 4 : auto self - refresh (asr): set mr2 a6 = 0b to disable or 1b to enable feature note 5: self - refresh temperature range (srt): set mr2 a7=0b for normal or 1b for extended temperature range note 6 : refer to dram supplier data sheet and/or dimm spd to determine if optional features or requirements are supported by ddr3 sdram device note 7 : re ad burst type: nibble sequential, set mr0 a[3] = 0b 1gb auto-as4c64m16d3 confidential --25/86 rev.1.0 june 2015
table 18. electrical characteristics and recommended a.c. operating conditions (v dd = 1 .5 v 0.075 v , t oper = -4 0~10 5 c) symbol parameter - 12 unit note min. max. t aa internal read command to first data 13.75 20 ns t rcd act to internal read or write delay time 13.75 - ns t rp pre command period 13.75 - ns t rc act to act or ref command period 48 .75 - ns t ras active to precharge command period 35 9 * t refi ns t ck(avg) average clock period cl=7, cwl=6 1.875 <2.5 ns 33 cl=8, cwl= 6 1.875 <2.5 ns 33 cl=9, cwl=7 1.5 <1.875 ns 33 cl=10, cwl= 7 1.5 <1.875 ns 33 cl=1 1 , cwl=8 1.25 <1. 5 ns 33 t ck (dll_off) minimum clock cycle time (dll off mode) 8 - ns 6 t ch(avg) average clock high pulse width 0.47 0.53 t ck t cl(avg) average clock low pulse width 0.47 0.53 t ck t dqsq dqs, dqs# to dq skew, per group, per access - 100 ps 13 t qh dq output hold time from dqs, dqs# 0.38 - t ck 13 t lz(dq) dq low - impedance time from ck, ck# - 450 225 ps 13,14 t hz(dq) dq high impedance time from ck, ck# - 225 ps 13,14 t ds(base) data setup time to dqs, dqs# referenced to vih(ac) / vil(ac) levels ac150 10 - ps 17 t dh(base) data hold time from dqs, dqs# referenced to vih(dc) / vil(dc) levels dc100 45 - ps 17 t dipw dq and dm input pulse width for each input 360 - ps t rpre dqs,dqs# differential read preamble 0.9 - t ck 13,19 t rpst dqs, dqs# differential read postamble 0.3 - t ck 11,13 t qsh dqs, dqs# differential output high time 0.4 - t ck 13 t qsl dqs, dqs# differential output low time 0.4 - t ck 13 t wpre dqs, dqs# differential write preamble 0.9 - t ck 1 t wpst dqs, dqs# differential write postamble 0.3 - t ck 1 t dqsck dqs, dqs# rising edge output access time from rising ck, ck# - 225 225 ps 13 t lz(dqs) dqs and dqs# low - impedance time (referenced from rl - 1) - 450 225 ps 13, 14 t hz(dqs) dqs and dqs# high - impedance time (referenced from rl + bl/2) - 225 ps 13, 14 t dqsl dqs, dqs# differential input low pulse width 0.45 0.55 t ck 29, 31 t dqsh dqs , dqs# differential input high pulse width 0.45 0.55 t ck 30, 31 t dqss dqs, dqs# rising edge to ck, ck# rising edge - 0.27 0.27 t ck t dss dqs, dqs# falling edge setup time to ck, ck# rising edge 0.18 - t ck 32 t dsh dqs, dqs# falling edge hold time from ck, ck# rising edge 0.18 - t ck 32 t dllk dll locking time 512 - t ck t rtp internal read command to precharge command delay max (4 t ck , 7.5ns) - t ck t wtr delay from start of internal write transaction to internal read command max (4 t ck , 7.5ns) - t ck 18 t wr write recovery time 15 - ns 18 t mrd mode register set command cycle time 4 - t ck t mod mode register set command update delay m ax (12 t ck , 15ns) - t ck t ccd cas# to cas# command delay 4 - t ck t dal(min) auto precharge write recovery + prechargetime wr + t rp t ck 1gb auto-as4c64m16d3 confidential --26/86 rev.1.0 june 2015
t mprr multi - purpose register recovery time 1 - t ck 22 t rrd active to active command period max (4 t ck , 7.5ns) - t ck t faw four activate window 40 - ns t is(base) command and address setup time to ck, ck# referenced to vih(ac) / vil(ac) levels ac1 75 45 - ps 16 t is(base) ac150 170 - ps 16,27 t ih(base) command and address hold time from ck, ck# referenced to vih(dc) / vil(dc) levels dc100 120 - ps 16 t ipw control and address input pulse width for each input 560 - ps 28 t zqinit power - up and r eset calibration time 512 - t ck t zqoper normal operation full calibration time 256 - t ck t zqcs normal operation short calibration time 64 - t ck 23 t xpr exit reset from cke high to a valid command m ax (5 t ck , t rfc(min) + 10ns) - t ck t xs exit self refr esh to commands not requiring a locked dll m ax (5 t ck , t rfc(min) + 10ns) - t ck t xsdll exit self refresh to commands requiring a locked dll tdllk (min) - t ck t ckesr minimum cke low width for self refresh entry to exit timing tcke (min) + 1t ck - t ck t cksre valid clock requirement after self refresh entry (sre) or power - down entry (pde) max(5 t ck , 10 ns) - t ck t cksrx valid clock requirement before self refresh exit (srx) or power - down exit (pdx) or reset exit m ax (5 t ck , 10 ns) - t ck t xp exit power down with dll on to any valid command; exit precharge power down with dll frozen to commands not requiring a locked dll m ax ( 3t ck , 6 ns) - t ck t xpdll exit precharge power down with dll frozen to commands requiring a lockeddll m ax ( 10t ck , 24 ns) - t ck 2 t cke cke minimum pulse width m ax ( 3t ck , 5 ns) - t ck t cpded command pass disable delay 2 - t ck t pd power down entry to exit timing tcke (min) 9 * t refi 15 t actpden timing of act command to power down entry 1 - t ck 20 t prpden timing of pre or prea command to power down entry 1 - t ck 20 t rdpden timing of rd/rda command to power down entry rl + 4 + 1 - t ck t wrpden timing of wr command to power down entry (bl8otf, bl8mrs, bc4otf) wl + 4 + (t wr / t ck ) - t ck 9 t wrapden timing of wra command to power down en try (bl8otf, bl8mrs,bc4otf) wl + 4 + wr + 1 - t ck 10 t wrpden timing of wr command to power down entry (bc4mrs) wl + 2 + (t wr / t ck ) - t ck 9 t wrapden timing of wra command to power down entry (bc4mrs) wl + 2 + wr + 1 - t ck 10 t refpden timing of ref comma nd to power down entry 1 - t ck 20, 21 t mrspden timing of mrs command to power down entry tmod (min) - odtlon odt turn on latency wl - 2 = cwl + al - 2 t ck odtloff odt turn off latency wl - 2 = cwl + al - 2 odth4 odt high time without write command or with write command and bc4 4 - t ck odth8 odt high time with write command and bl8 6 - t ck t aonpd asynchronous rtt turn - on delay (power - down with dll frozen) 2 8.5 ns t aofpd asynchronous rtt turn - off delay (power - down with dll frozen) 2 8.5 ns t aon rtt turn - on - 225 225 ps 7 1gb auto-as4c64m16d3 confidential --27/86 rev.1.0 june 2015
t aof rtt_nom and rtt_wr turn - off time from odtloff reference 0.3 0.7 t ck 8 t adc rtt dynamic change skew 0.3 0.7 t ck t wlmrd first dqs/dqs# rising edge after write leveling mode is programmed 40 - t ck 3 t wldqsen dqs/dqs# delay after write leveling mode is programmed 25 - t ck 3 t wls write leveling setup time from rising ck, ck# crossing to rising dqs, dqs# crossing 165 - ps t wlh write leveling hold time from rising dqs, dqs# crossing to rising ck, ck# crossing 165 - ps t wlo write leveling output delay 0 7.5 ns t wloe write leveling output error 0 2 ns t rfc ref command to act or ref command time 110 - ns t refi average periodic refresh interval -40 ? to 8 5 ? - 7.8 ? 85? to 10 5 ? - 3.9 ? note 1: actual valu e dependant upon measurement level. note 2: commands requiring a locked dll are: read (and rap) and synchronous odt commands. note 3: the max values are system dependent. note 4: wr as programmed in mode register . note 5: value must be rounded - up to next h igher integer value note 6: there is no maximum cycle time limit besides the need to satisfy the refresh interval, trefi. note 7 : for definiti on of rtt turn - on time taon see ?iming parameters . note 8 : for definitio n of rtt turn - off time taof see ?iming parameters . note 9 : twr is defined in ns, for calculation of twrpden it is necessary to round up twr / tck to the next integer. note 10 : wr in clock cycles as programmed in mr0. note 11 : the maximum read postamble is bound by tdqsck(min) plus tqsh(min) on the left side and thz(dqs)max on the right side. see ?lock to data strobe relationship . note 12 : output timing deratings are relative to the sdram input clock. when the device is operated with input clock jitter, this parameter needs to be derated by t. b.d. note 13 : value is only valid for ron34 . note 14 : single ended signal parameter. note 15 : trefi depends on toper . note 16 : tis(base) and tih(base) values are for 1v/ns cmd/add single - ended slew rate and 2v/ns ck, ck# differential slew rate. note for d q and dm signals, vref(dc) = vrefdq(dc). for input only pins except res et#, vref(dc) = vrefca(dc). see ?ddress / command setup, hold and derating . note 17 : tds(base) and tdh(base) values are for 1v/ns dq single - ended slew rate and 2v/ns dqs, dqs# differe ntial slew rate. note for dq and dm signals, vref(dc) = vrefdq(dc). for input only pins except res et#, vref(dc) = vrefca(dc). see ?ata setup, hold and slew rate derating . note 18 : start of internal write transaction is defined as follows: - for bl8 (fix ed by mrs and on - the - fly): rising clock edge 4 clock cycles after wl. - for bc4 (on - the - fly): rising clock edge 4 clock cycles after wl. - for bc4 (fixed by mrs): rising clock edge 2 clock cycles after wl. note 19 : the maximum read preamble is bound b y tlz(dqs)min on the left side and tdqsck(max) on the right side. see ?lo ck to data strobe relationship . note 20 : cke is allowed to be registered low while operations such as row activation, precharge, autoprecharge or refresh are in progress, but power - down idd spec will not be applied until finishing those operations. note 21 : although cke is allowed to be registered low after a refresh command once trefpden(min) is satisfied, there are cases where additional time such as txpdll(min) is also required. s ee ?ower - down clarifications - case 2 . note 22 : defined between end of mpr read burst and mrs which reloads mpr or disables mpr function. 1gb auto-as4c64m16d3 confidential --28/86 rev.1.0 june 2015
note 23 : one zqcs command can effectively correct a minimum of 0.5 % (zq correction) of ron and rtt impedance error w ithin 64 nck for all speed bins assuming the maximum sensitivities specified in the output driver voltage and temperature sensitivity and odt voltage and temperature sensitivity tables. the appropriate interval between zqcs commands can be determined f rom these tables and other application - specific parameters. one method for calculating the interval between zqcs commands, given the temperature (tdriftrate) and voltage (vdriftrate) drift rates that the sdram is subject to in the application, is illustrated. t he interval could be defined by the following formula: (tsens tdriftrate) + (vsens vdriftrate) zqcorrection where tsens = max(drttdt, drondtm) and vsens = max(drttdv, drondvm) define the sdram temperature a nd voltage sensitivities. for example, if tsens = 1.5% / oc, vsens = 0.15% / mv, tdriftrate = 1 oc / sec and vdriftrate = 15 mv / sec, then the interval between zqcs commands is calculated as: (1.5 1) + (0.15 15) 0.5 = 0.133 128ms note 24 : n = from 13 cycles to 50 cycles. this row defines 38 parameters. note 25 : tch(abs) is the absolute instantaneous clock high pulse width, as measured from one rising edge to the following falling edge . note 26 : tcl(abs) is the absolute instantaneous clock low pulse width, as measured from one falling edge to the following rising edge. note 27 : the tis(base) ac150 specifications are adjusted from the tis(base) specification by adding an additional 100 p s of derating to accommodate for the lower alternate threshold of 150 mv and another 25 ps to account for the earlier reference point [(175 mv - 150 mv) / 1 v/ns]. note 28 : pulse width of a input signal is defined as the width between the first crossing of vref(dc) and the consecutive crossing of vref(dc). note 29 : tdqsl describes the instantaneous differential input low pulse width on dqs - dqs#, as measured from one falling edge to the next consecutive rising edge. note 30 : tdqsh describes the instantaneo us differential input high pulse width on dqs - dqs#, as measured from one rising edge to the next consecutive falling edge. note 31 : tdqsh,act + tdqsl,act = 1 tck,act ; with txyz,act being the actual measured value of the respective timing parameter in the application. note 32 : tdsh,act + tdss,act = 1 tck,act ; with txyz,act being the actual measured value of the respective timing parameter in the application. note 33 : the cl and cwl settings result in tck requirements. when making a selection of tck, both cl and cwl requirement settings need to be fulfilled. 1gb auto-as4c64m16d3 confidential --29/86 rev.1.0 june 2015
- multi-purpose register (mpr) the multi purpose register (mpr) function is used to read out a predefined system timing calibration bit sequence. figure 8. mpr block diagram memory core (all banks precharged) mrs 3 a2 dq, dm, dqs, dqs# multipurpose register pre-defined data for reads to enable the mpr, a mode register set (mrs) command must be issued to mr3 register with bit a2 = 1 . prior to issuing the mrs command, all banks must be in the idle state (all banks precharged and trp met). once the mpr is enabled, any subsequent rd or rda commands will be redirected to the multi purpose register. the resulting operation, when a rd or rda command is issued, is defined by mr3 bits a[1:0] when the mpr is enabled as shown in table 11 . when the mpr is enabled, only rd or rda commands a re allowed until a subsequent mrs command is issued with the mpr disabled (mr3 bit a2 = 0). note that in mpr mode rda has the same functionality as a read command which means the auto precharge part of rda is ignored. power - down mode, self - refresh and any other non - rd/rda command is not allowed during mpr enable mode. the reset function is supported during mpr enable mode. table 19. mpr mr3 register definition mr3 a[2] mr3 a[1:0] function mpr mpr - loc 0b d on t care (0b or 1b) normal operation, no mpr tra nsaction. all subsequent reads will come from dram array. all subsequent write will go to dram array. 1b see the table11 enable mpr mode, subsequent rd/rda commands defined by mr3 a[1:0]. 1gb auto-as4c64m16d3 confidential --30/86 rev.1.0 june 2015
- mpr functional description one bit wide logical in terface via all dq pins during read operation. register read on x16: dql[0] and dqu[0] drive information from mpr. dql[7:1] and dqu[7:1] either drive the same information as dql [0], or they drive 0b. addressing during for multi purpose register re ads for all mpr agents: ba [2:0]: dont care a[1:0]: a[1:0] must be equal to 00b. data read burst order in nibble is fixed a[2]: for bl=8, a[2] must be equal to 0b, burst order is fixed to [0,1,2,3,4,5,6,7], *) for burst chop 4 cases, the burst order is switched on nibble base a [2]=0b, burst order: 0,1,2,3 *) a[2]=1b, burst order: 4,5,6,7 *) a[9:3]: dont care a10/ap: dont care a12/bc: selects burst chop mode on - the - fly, if enabled within mr0. a11 (if available): dont care regular inter face functionality during register reads: support two burst ordering which are switched with a2 and a[1:0]=00b. support of read burst chop (mrs and on - the - fly via a12/bc) all other address bits (remaining column address bits including a10, all bank a ddress bits) will be ignored by the ddr3 sdram. regular read latencies and ac timings apply. dll must be locked prior to mpr reads. note: *) burst order bit 0 is assigned to lsb and burst order bit 7 is assigned to msb of the selected mpr agent. table 20. mpr mr3 register definition mr3 a[2] mr3 a[1:0] function burst length read address a[2:0] burst order and data pattern 1b 00b read predefined pattern for system calibration bl8 000b burst order 0, 1, 2, 3, 4, 5, 6, 7 pre - defined data pattern [0, 1, 0, 1, 0, 1, 0, 1] bc4 000b burst order 0, 1, 2, 3 pre - defined data pattern [0, 1, 0, 1] bc4 100b burst order 4, 5, 6, 7 pre - defined data pattern [0, 1, 0, 1] 1b 01b rfu bl8 000b burst order 0, 1, 2, 3, 4, 5, 6, 7 bc4 000b burst order 0, 1, 2, 3 bc4 100b burst order 4, 5, 6, 7 1b 10b rfu bl8 000b burst order 0, 1, 2, 3, 4, 5, 6, 7 bc4 000b burst order 0, 1, 2, 3 bc4 100b burst order 4, 5, 6, 7 1b 11b rfu bl8 000b burst order 0, 1, 2, 3, 4, 5, 6, 7 bc4 000b burst order 0, 1, 2, 3 bc4 100b burst order 4, 5, 6, 7 l no operation (nop) command the no operation (nop) command is used to i nstruct the selected ddr3 sdram to perform a nop ( cs# low and ras# , cas# and we# high). this prevents unwanted commands from being registered during idle or wait states. operations already in progress are not affected. l deselect command the deselect function ( cs# high) prevents new commands from being executed by the ddr3 sdram. the ddr3 sdram is effectively deselected. operations already in pro gress are not affected. 1gb auto-as4c64m16d3 confidential --31/86 rev.1.0 june 2015
l dll - off mode ddr3 dll - off mode is entered by setting mr1 bit a0 to 1 ; this will disable the dll for subsequent operations until a0 bit set back to 0. the mr1 a0 bit for dll control can be switched either during initializa tion or later. the dll - off mode operations listed below are an optional feature for ddr3 . the maximum clock frequency for dll - off mode is specified by the parameter tckdll_off. there is no minimum frequency limit besides the need to satisfy the refresh int erval, trefi. due to latency counter and timing restrictions, only one value of cas latency (cl) in mr0 and cas write latency (cwl) in mr2 are supported. the dll - off mode is only required to support setting of both cl=6 and cwl=6. dll - off mode will affect the read data clock to data strobe relationship (tdqsck) but not the data strobe to data relationship (tdqsq, tqh). special attention is needed to line up read data to controller time domain. comparing with dll - on mode, where tdqsck starts from the rising clock edge (al+cl) cycles after the read command, the dll - off mode tdqsck starts (al+cl - 1) cycles after the read command. another difference is that tdqsck may not be small compared to tck (it might even be larger than tck) and the difference between tdqs ckmin and tdqsckmax is significantly larger than in dll - on mode. the timing relations on dll - off mode read operation have shown at the following timing diagram (cl=6, bl=8) figure 9. dll -off mode read timing operation ck# t1 t2 t3 t4 t5 t6 t7 t8 t9 t0 address ck t10 command dqs# dqs don't care nop read nop nop nop nop nop nop nop nop nop bank, col b rl (dll_on) = al + cl = 6 (cl = 6, al = 0) cl = 6 din b din b+1 din b+2 din b+3 din b+4 din b+5 din b+6 din b+7 dq din b din b+1 din b+2 din b+3 din b+4 din b+5 din b+6 din b+7 dqs# dqs dq din b din b+1 din b+2 din b+3 din b+4 din b+5 din b+6 din b+7 dqs# dqs dq (dll_on) (dll_on) (dll_off) (dll_off) (dll_off) (dll_off) rl (dll_off) = al + (cl-1) = 5 t dqsck(dll_off)_min t dqsck(dll_off)_max note 1. the tdqsck is used here for dqs, dqs# and dq to have a simplified diagram; the dll_off shift will affect both timings in the same way and the skew between all dq and dqs, dqs# signals will still be tdqsq. transitioning data 1gb auto-as4c64m16d3 confidential --32/86 rev.1.0 june 2015
l dll on/off switching procedure ddr3 dll - off mode is entered by setting mr1 bit a0 to 1; this will disable the dll for subsequent operation until a0 bit set back to 0. l dll ?n?to dll ?ff?procedure to switch from dll on to dll off requires th e frequency to be changed during self - refresh outlined in the following procedure: 1 . starting from idle state (all banks pre - charged, all timing fulfilled, and drams on - die termination resistors, rtt, must be in high impedance state before mrs to mr1 to d isable the dll). 2 . set mr1 bit a0 to 1 to disable the dll. 3 . wait tmod. 4. enter self refresh mode; wait until (tcksre) satisfied. 5 . change frequency, in guidance with input clock frequency change section. 6 . wait until a stable clock is available f or at least (tcksrx) at dram inputs. 7. starting with the self refresh exit command, cke must continuously be registered high until all tmod timings from any mrs command are satisfied. in addition, if any odt features were enabled in the mode registers whe n self refresh mode was entered, the odt signal must continuously be registered low until all tmod timings from any mrs command are satisfied. if both odt features were disabled in the mode registers when self refresh mode was entered, odt signal can be registered low or high. 8. wait txs, and then set mode registers with appropriate values (especially an update of cl, cwl, and wr may be necessary. a zqcl command may also be issued after txs). 9. wait for tmod, and then dram is ready for next command. figure 10. dll switch sequence from dll-on to dll-off t1 ta0 ta1 tb0 tc0 td0 td1 te0 te1 t0 tf0 t mod notes 1 don't care time break nop mrs sre nop srx nop mrs nop valid valid t cksre notes 2 notes 3 notes 6 notes 7 notes 8 notes 8 notes 4 t cksrx notes 5 t xs t mod t ckesr valid notes 8 notes: 1. starting with idle state, rtt in hi-z state 2. disable dll by setting mr1 bit a0 to 1 3. enter sr 4. change frequency 5. clock must be stable tcksrx 6. exit sr 7. update mode registers with dll off parameters setting 8. any valid command odt: static low in case rtt_nom and rtt_wr is enabled, otherwise static low or high ck# ck command cke odt 1gb auto-as4c64m16d3 confidential --33/86 rev.1.0 june 2015
l dll ?ff?to dll ?n?procedure to switch from dll off to dll on (with requires frequency change) during self - refresh: 1 . starting from idle state (all banks pre - charged, all timings fulfilled and drams on - die termination resistors (rtt) must be in high impedance state before self - refresh mode is entered). 2 . enter self refresh mode, wait until tcksre satisfied. 3 . change frequency, in guidance with input clock fr equency change section. 4 . wait until a stable clock is available for at least (tcksrx) at dram inputs. 5 . starting with the self refresh exit command, cke must continuously be registered high until tdllk timing from subsequent dll reset command is satisf ied. in addition, if any odt features were enabled in the mode registers when self refresh mode was entered , the odt signal must continuously be registered low until tdllk timings from subsequent dll reset command is satisfied. if both odt features are dis abled in the mode registers when self refresh mode was entered, odt signal can be registered low or high. 6 . wait txs, then set mr1 bit a0 to 0 to enable the dll. 7 . wait tmrd, then set mr0 bit a8 to 1 to start dll reset. 8 . wait tmrd, then set mode re gisters with appropriate values (especially an update of cl, cwl, and wr may be necessary. after tmod satisfied from any proceeding mrs command, a zqcl command may also be issued during or after tdllk). 9 . wait for tmod, then dram is ready for next command (remember to wait tdllk after dll reset before applying command requiring a locked dll!). in addition, wait also for tzqoper in case a zqcl command was issued. figure 11. dll switch sequence from dll-off to dll on ck# ta0 ta1 tb0 tc0 tc1 td0 te0 tf1 tg0 t0 ck th0 command cke odt notes 1 don't care time break sre nop nop srx mrs mrs mrs valid valid t cksre notes 2 notes 5 notes 7 notes 3 t cksrx notes 4 t xs t mrd t ckesr notes: 1. starting with idle state 2. enter sr 3. change frequency 4. clock must be stable tcksrx 5. exit sr 6. set dll on by mr1 a0 = 0 7. start dll reset by mr0 a8=1 8. update mode registers 9. any valid command odt: static low in case rtt_nom and rtt_wr is enabled, otherwise static low or high notes 6 notes 8 t dllk odtloff + 1 * tck t mrd notes 9 1gb auto-as4c64m16d3 confidential --34/86 rev.1.0 june 2015
l jitter notes note 1. unit tck(avg) represents the actual tck(avg) of the input clock under operation. unit nck represents one clock cycle of the input clock, counting the actual clock edges.ex) tmrd = 4 [nck] means; if one mode register set command is r egistered at tm, another mode register set command may be registered at tm+4, even if (tm+4 - tm) is 4 x tck(avg) + terr(4per),min. n ote 2. these parameters are measured from a command/address signal (cke, cs#, ras#, cas#, we#, odt, ba0, a0, a1, etc.) tran sition edge to its respective clock signal (ck/ck#) crossing. the spec values are not affected by the amount of clock jitter applied (i.e. tjit(per), tjit(cc), etc.), as the setup and hold are relative to the clock signal crossing that latches the command/address. that is, these parameters should be met whether clock jitter is present or not. n ote 3. these parameters are measured from a data strobe signal (dqs(l/u), dqs(l/u)#) crossing to its respective clock signal (ck, ck#) crossing. the spec values are n ot affected by the amount of clock jitter applied (i.e. tjit(per), tjit(cc), etc.), as these are relative to the clock signal crossing. that is, these parameters should be met whether clock jitter is present or not. n ote 4. these parameters are measured fr om a data signal (dm(l/u), dq(l/u)0, dq(l/u)1, etc.) transition edge to its respective data strobe signal (dqs(l/u), dqs(l/u)#) crossing. n ote 5. for these parameters, the ddr3 sdram device supports tnparam [nck] = ru{ tparam [ns] / tck(avg) [ns] }, which is in clock cycles, assuming all input clock jitter specifications are satisfied. n ote 6. when the device is operated with input clock jitter, this parameter needs to be derated by the actual terr(mper),act of the input clock, where 2 <= m <= 12. (output d eratings are relative to the sdram input clock.) n ote 7. when the device is operated with input clock jitter, this parameter needs to be derated by the actual tjit(per),act of the input clock. (output deratings are relative to the sdram input clock.) table 21. input clock jitter spec parameter parameter symbol - 12 unit min . max . clock period jitter t jit ( per) - 70 70 ps clock period jitter during dll locking period t jit (per,lck) - 60 60 ps cycle to cycle clock period jitter t jit (cc) 140 ps cycl e to cycle clock period jitter during dll locking period t jit (cc,lck) 120 ps cumulative error across 2 cycles t err (2per) - 103 103 ps cumulative error across 3 cycles t err (3per) - 122 122 ps cumulative error across 4 cycles t err (4per) - 136 136 ps cum ulative error across 5 cycles t err (5per) - 147 147 ps cumulative error across 6 cycles t err (6 per) - 155 155 ps cumulative error across 7 cycles t err (7 per) - 163 163 ps cumulative error across 8 cycles t err (8 per) - 169 169 ps cumulative error across 9 c ycles t err (9 per) - 175 175 ps cumulative error across 10 cycles t err ( 10per) - 180 180 ps cumulative error across 11 cycles t err ( 11per) - 184 184 ps cumulative error across 12 cycles t err ( 12per) - 188 188 ps cumulative error across n cycles, n=1 3 ...50, inclusive t err (n per) t err (n per) min = (1+ 0.68ln(n)) * t jit (per) min t err (n per) max = (1+ 0.68ln(n)) * t jit (per) max ps 1gb auto-as4c64m16d3 confidential --35/86 rev.1.0 june 2015
l input clock frequency change once the ddr3 sdram is initialized, the ddr3 sdram requires the clock to be stable during almost all states of normal operation. this means once the clock frequency has been set and is to be in the stable state, the clock period is not allowed to deviate except for what is allowed for by the clock jitter and ssc (spread spectrum clocking) specification . the input clock frequency can be changed from one stable clock rate to another stable clock rate under two conditions: (1) self - refresh mode and (2) precharge power - down mode. outside of these two modes, it is illegal to change the clock frequency. for t he first condition, once the ddr3 sdram has been successfully placed in to self - refresh mode and tcksre has been satisfied, the state of the clock becomes a dont care. once a dont care, changing the clock frequency is permissible, provided the new clock frequency is stable prior to tcksrx. when entering and exiting self - refresh mode of the sole purpose of changing the clock frequency , the self - refresh entry and exit specifications must still be met . the ddr3 sdram input clock frequency is allowed to chang e only within the minimum and maximum operating frequency specified for the particular speed grade. the second condition is when the ddr3 sdram is in precharge power - down mode (either fast exit mode or slow exit mode). if the rtt_nom feature was enabled i n the mode register prior to entering precharge power down mode, the odt signal must continuously be registered low ensuring rtt is in an off state. if the rtt_nom feature was disabled in the mode register prior to entering precharge power down mode, rtt w ill remain in the off state. the odt signal can be registered either low or high in this case. a minimum of tcksre must occur after cke goes low before the clock frequency may change. the ddr3 sdram input clock frequency is allowed to change only within th e minimum and maximum operating frequency specified for the particular speed grade. during the input clock frequency change, odt and cke must be held at stable low levels. once the input clock frequency is changed, stable new clocks must be provided to the dram tcksrx before precharge power down may be exited; after precharge power down is exited and txp has expired, the dll must be reset via mrs. depending on the new clock frequency additional mrs commands may need to be issued to appropriately set the wr, cl, and cwl with cke continuously registered high. during dll re - lock period, odt must remain low and cke must remain high. after the dll lock time, the dram is ready to operate with new clock frequency. figure 1 2. change frequency during precharge power- down ck# t1 t2 ta0 tb0 tc0 tc1 td0 td1 te0 t0 address ck te1 command odt nop nop nop nop nop mrs nop valid dll reset high-z high-z dqs# dqs dq dm notes 1. applicable for both slow exit and fast exit precharge power-down. 2. taofpd and taof must be statisfied and outputs high-z prior to t1;refer to odt timing section for exact requirements 3. if the rtt_nom feature was enabled in the mode register prior to entering precharge power down mode, the odt signal must continuously be registered low ensuring rtt is in an off state, as shown in figure 13. if the rtt_nom feature was disabled in the mode register prior to entering precharge power down mode, rtt will remain in the off state. the odt signal can be registered either low or high in this case. t ch t cl t ck t cksre t chb t clb t ckb t chb t clb t ckb t chb t clb t ckb t cksrx t cke cke t ih t is valid t xp enter precharge power-down mode t cpded previous clock frequency new clock frequency t aofpd / t aof frequency change exit precharge power-down mode t dllk don't care indicates a break in time scale t ih t is t ih t is 1gb auto-as4c64m16d3 confidential --36/86 rev.1.0 june 2015
l write leveling for better signal integrity, ddr3 memory adopted fly by topology for the commands, addresses, control signals, and clocks. the fly by topology has benefits from reducing number of stubs and their length b ut in other aspect, causes flight time skew between clock and strobe at every dram on dimm. it makes it difficult for the controller to maintain tdqss, tdss, and tdsh specification. therefore, the controller should support write leveling in ddr3 sdram to compensate the skew. the memory controller can use the write leveling feature and feedback from the ddr3 sdram to adjust the dqs dqs# to ck ck# relationship. the memory controller involved in the leveling must have adjustable delay setting on dqs dqs# to align the rising edge of dqs dqs# with that of the clock at the dram pin. dram asynchronously feeds back ck ck# , sampled with the rising edge of dqs dqs# , through the dq bus. the controller repeatedly delays dqs dqs# until a transition from 0 to 1 is detected. the dqs dqs# delay established though this exercise would ensure tdqss specification. besides tdqss, tdss, and tdsh specification also needs to be fulfilled. one way to achieve this is to combine the actual tdqss in the application w ith an appropriate duty cycle and jitter on the dqs - dqs# signals. depending on the actual tdqss in the application, the actual values for tdqsl and tdqsh may have to be better than the absolute limits provided in ?c timing parameters?section in order to satisfy tdss and tdsh specification. dqs/dqs# driven by the controller during leveling mode must be determined by the dram based on ranks populated. similarly, the dq bus driven by the dram must also be terminated at the controller. one or more data bits should carry the leveling feedback to the controller across the dram configurations x16. on a x16 device, both byte lanes should be leveled independently. therefore, a separate feedback mechanism should be available for each byte lane. the upper data bits should provide the feedback of the upper diff_dqs (diff_udqs) to clock relationship whereas the lower data bits would indicate the lower diff_dqs (diff_ldqs) to clock relationship. figure 1 3. write leveling concept ck# t1 t2 t3 t4 t5 t6 t7 t0 ck diff_dqs dq source destination t0 t1 t2 t3 t4 t5 t6 tn ck# ck diff_dqs 0 0 dq diff_dqs 1 1 push dqs to capture 0-1 transition 0 or 1 0 or 1 0 1 1gb auto-as4c64m16d3 confidential --37/86 rev.1.0 june 2015
l dram setting for write leveling and dram termination f unction in that mode dram enters into write leveling mode if a7 in mr1 set high and after finishing leveling, dram exits from write leveling mode if a7 in mr1 set low. note that in write leveling mo de, only dqs/ dqs# terminations are activated and deactivated via odt pin not like normal operation. table 22. dram termination function in the leveling mode odt pi n at dram dqs, dqs# termination dqs termination de - asserted off off asserted on off note 1: in write leveling mode with its output buffer disabled (mr1[bit7]=1 with mr1[bit12]=1) all rtt_nom settings are allowed; in write leveling mode with its output buffer enabled (mr1[bit7]=1 with mr1[bit12]=0) only rtt_nom settings of rzq/2, rzq/4, and r zq/6 are allowed. l procedure description memory controller initiates leveling mode of all drams by setting bit 7 of mr1 to 1. with entering write leveling mode, the dq pins are in undefined driving mode. during write leveling mode, only nop or deselect com mands are allowed. as well as an mrs command to exit write leveling mode. since the controller levels one rank at a time, the output of other rank must be disabled by setting mr1 bit a12 to 1. controller may assert odt after tmod, time at which dram is rea dy to accept the odt signal. controller may drive dqs low and dqs# high after a delay of twldqsen, at which time dram has applied on - die termination on these signals. after tdqsl and twlmrd controller provides a single dqs, dqs# edge which is used by the d ram to sample ck ck# driven from controller. twlmrd(max) timing is controller dependent. dram samples ck ck# status with rising edge of dqs and provides feedback on all the dq bits asynchronously after twlo timing. there is a dq output uncertainty of twloe defined to allow mismatch on dq bits; there are no read strobes (dqs/dqs) needed for these dqs. controller samples incoming dq and decides to increment or decrement dqs dqs# delay setting and launches the next dqs/ dqs# pulse after some time, which is controller dependent. once a 0 to 1 transition is detected, the controller locks dqs dqs# delay setting and write leveling is achieved for the device. figure 14 . timing details of write leveling sequence ( dqs dqs# is capturing ck ck# low at t1 and ck ck# high at t2 ) t wlmrd don't care time break nop mrs nop nop nop nop nop nop nop nop nop t wls t wlh t1 t wls t wlh t2 nop notes 1 notes 2 t wldqsen t dqsl notes 6 t dqsh notes 6 t dqsl notes 6 t dqsh notes 6 ck# ck command odt diff_dqs prime dq notes 5 notes 4 one prime dq: notes 3 late prime dqs early prime dqs all dqs are prime: notes 3 notes 3 late remaining dqs early remaining dqs t wlo t wlo t wlo t wloe t wlo t wloe t wlo t mod t wlo t wlmrd t wlo t wlo t wloe undefined driving mode notes 1. mrs: load mr1 to enter write leveling mode. 2. nop: nop or deselect. 3. dram has the option to drive leveling feedback on a prime dq or all dqs. if feedback is driven only on one dq, the remaining dqs must be driven low, as shown in above figure, and maintained at this state through out the leveling procedure. 4. diff_dqs is the differential data strobe (dqs, dqs#). timing reference points are the zero crossings. dqs is shown with solid line, dqs# is shown with dotted line. 5. ck, ck# : ck is shown with solid dark line, where as ck# is drawn with dotted line. 6. dqs, dqs# needs to fulfill minimum pulse width requirements tdqsh(min) and tdqsl(min) as defined for regular writes; the max pulse width is system dependent. 1gb auto-as4c64m16d3 confidential --38/86 rev.1.0 june 2015
l write leveling mode exit the following sequence describes how write leveling mode should be exited: 1. after the last rising strobe edge (see ~t0), stop driving the strobe signals (see ~tc0). note: fr om now on, dq pins are in undefined driving mode, and will remain undefined, until tmod after the respective mr command (te1). 2. drive odt pin low (tis must be satisfied) and keep it low (see tb0). 3. after the rtt is switched off, disable write level mod e via mrs command (see tc2). 4. after tmod is satisfied (te1), any valid command may be registered. (mr commands may be issued after tmrd (td1). figure 15 . timing de tails of write leveling exit don't care time break nop nop nop nop nop nop nop mrs nop valid nop valid t wlo t aofmin undefined driving mode t1 t2 ta0 tb0 tc0 tc1 tc2 t0 td0 td1 te0 te1 notes: 1. the dq result = 1 between ta0 and tc0 is a result of the dqs, dqs# signals capturing ck high just after the t0 state. mr1 valid valid t mrd rtt_nom result = 1 transitioning t aofmax t is odtloff t mod ck# ck command address odt rtt_dqs_dqs# dq dqs_dqs# rtt_dq notes 1 l extended temperature usage u sers should refer to the dram supplier data sheet and/or the dimm spd to determine if ddr3 sdram devices support the following options or requirements referred to in this material: 1. auto self - refresh supported 2. extended temperature range supported 3. d ouble refresh required for operation in the extended temperature range (applies only for devices supporting the extended temperature range) l auto self-refresh mode - asr mode ddr3 sdram provides an auto - refresh mode (asr) for application ease. asr mode is enabled by setting mr2 bit a6=1 and mr2 bit a7=0. the dram will manage self - refresh entry in either the normal or extended temperature ranges . in this mode, the dram will also manage self - refresh power consumption when the dram operating temperature changes, lower at low temperatures and higher at high temperatures. if the asr option is not supported by dram, mr2 bit a6 must set to 0. if the asr option is not enabled (mr2 bit a6=0), the srt bit (mr2 bit a7) must be manually programmed with the operating tem perature range required during self - refresh operation. support of the asr option does not automatically imply support of the extended temperature range. 1gb auto-as4c64m16d3 confidential --39/86 rev.1.0 june 2015
l self-refresh temperature range - srt srt applies to devices supporting extended temperature range only. if asr=0, the self - refresh temperature (srt) range bit must be programmed to guarantee proper self - refresh operation. if srt=0, then the dram will set an appropriate refresh rate for self - refresh operation in the normal temperature range. if srt=1, then the dram will set an appropriate, potentially different, refresh rate to allow self - refresh operation in either the normal or extended temperature ranges. the value of the srt bit can effect self - refresh power consumption, please refer to idd table fo r details. table 23. self-refresh mode summary mr2 a[6] mr2 a[7] self - refresh operation allowed operating temperature range for self - refresh mode 0 0 self - refresh rate appropriate for the normal temperature range normal (0 ~ 85 c) 0 1 self - refresh approp riate for either the normal or extended temperature ranges.the dram must support extended temperature range. the value of the srt bit can effect self - refresh power consumption, please refer to the idd table for details. normal and extended (0 ~ 95 c) 1 0 a sr enabled (for devices supporting asr and normal temperature range).self - refresh power consumption is temperature dependent. normal (0 ~ 85 c) 1 0 asr enabled (for devices supporting asr and extended temperature range).self - refresh power consumption is te mperature dependent. normal and extended (0 ~ 95 c) 1 1 illegal l active command the active command is used to open (or activate) a row in a particular bank for subsequent access. the value on the ba0 - ba2 inputs selects the bank, and the addresses provid ed on inputs a0 - a1 2 selects the row. these rows remain active (or open) for accesses until a precharge command is issued to that bank. a precharge command must be issued before opening a different row in the same bank. l precharge command the precharge comm and is used to deactivate the open row in a particular bank or the open row in all banks. the bank(s) will be available for a subsequent row activation a specified time (trp) after the precharge command is issued, except in the case of concurrent auto precharge, where a read or write command to a different bank is allowed as long as it does not interrupt the data transfer in the current bank and does not violate any other timing parameters. once a bank has been precharged, it is in the idle state and must be activated prior to any read or write commands being issued to that bank. a precharge command is allowed if there is no open row in that bank (idle bank) or if the previously open row is already in the process of precharging. however, the precharge period will be determined by the last precharge command issued to the bank. 1gb auto-as4c64m16d3 confidential --40/86 rev.1.0 june 2015
read operation l read burst operation durin g a read or write command ddr3 will support bc4 and bl8 on the fly using address a12 during the read or write (auto precharge can be enabled o r disabled). a12=0, bc4 (bc4 = burst chop, tccd=4) a12=1, bl8 a12 will be used only for burst length control, not a column address. figure 16 . read burst operation rl=5 (al=0, cl=5, bl=8) don't care nop read nop nop nop nop nop nop nop nop nop notes: 1. bl8, rl = 5, al = 0, cl = 5. 2. dout n = data-out from column n. 3. nop commands are shown for ease of illustration; other commands may be valid at these times. 4. bl8 setting activated by either mr0[a1:0 = 00] or mr0[a1:0 = 01] and a12 = 1 during read command at t0. t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 bank, col n transitioning data t rpre t rpst dout n dout n+1 dout n+2 dout n+3 dout n+4 dout n+5 dout n+6 dout n+7 rl = al + cl cl = 5 ck# ck dqs, dqs# dq notes 3 notes 2 address notes 4 command figure 17 . read burst operation rl=9 (al=4, cl=5, bl=8) don't care nop read nop nop nop nop nop nop nop nop nop notes: 1. bl8, rl = 9, al = (cl-1), cl = 5. 2. dout n = data-out from column n. 3. nop commands are shown for ease of illustration; other commands may be valid at these times. 4. bl8 setting activated by either mr0[a1:0 = 00] or mr0[a1:0 = 01] and a12 = 1 during read command at t0. t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 bank, col n transitioning data t rpre dout n dout n+1 dout n+2 rl = al + cl al = 4 cl = 5 ck# ck dqs, dqs# dq notes 3 notes 2 address notes 4 command 1gb auto-as4c64m16d3 confidential --41/86 rev.1.0 june 2015
l read timing definitions read timing is shown in the following figure and is applied when the dll is enabled and locked. rising data strobe edge parameters: tdqsck min/max describes the allowed ran ge for a rising data strobe edge relative to ck, ck# . tdqsck is the actual position of a rising strobe edge relative to ck, ck# . tqsh describes the dqs, dqs# differential output high time. tdqsq describes the latest valid transition of the associated dq pi ns. tqh describes the earliest invalid transition of the associated dq pins. falling data strobe edge parameters: tqsl describes the dqs, dqs# differential output low time. tdqsq describes the latest valid transition of the associated dq pins. tqh describ es the earliest invalid transition of the associated dq pins. tdqsq; both rising/falling edges of dqs, no tac defined. figure 18 . read timing definition t dqsck t dqsck,min ck# ck t dqsck,max t dqsck,max rising strobe region t dqsck,min dqs# dqs t dqsck t qsh t qsl rising strobe region associated dq pins t qh t qh t dqsq t dqsq 1gb auto-as4c64m16d3 confidential --42/86 rev.1.0 june 2015
l read timing; clock to data strobe relationship clock to data strobe relationship is shown in the following figure and is applied when the dll is enabled and locked. rising data strobe edge parameters: tdqsck min/max describes the allowed range for a rising data strobe edge relative to ck and ck# . tdqsck i s the actual position of a rising strobe edge relative to ck and ck# . tqsh describes the data strobe high pulse width. falling data strobe edge parameters: tqsl describes the data strobe low pulse width. figure 19. clock to data strobe relationship notes: 1. within a burst, rising strobe edge is not necessarily fixed to be always at tdqsck(min) or tdqsck(max). instead, rising strobe edge can vary between tdqsck(min) and tdqsck(max). 2. notwithstanding note 1, a rising strobe edge with tdqsck(max) at t(n) can not be immediately followed by a rising strobe edge with tdqsck(min) at t(n+1). this is because other timing relationships (tqsh, tqsl) exist: if tdqsck(n+1) < 0: tdqsck(n) < 1 . 0 tck - (tqshmin + tqslmin) - | tdqsck(n+1) | 3. the dqs, dqs# differential output high time is defined by tqsh and the dqs, dqs# differential output low time is defined by tqsl. 4. likewise, tlz(dqs)min and thz(dqs)min are not tied to tdqsckmin (early strobe case) and tlz(dqs)max and thz(dqs)max are not tied to tdqsckmax (late strobe case). 5. the minimum pulse width of read preamble is defined by trpre(min). 6. the maximum read postamble is bound by tdqsck(min) plus tqsh(min) on the left side and thzdsq(max) on the right side. 7. the minimum pulse width of read postamble is defined by trpst( min). 8. the maximum read preamble is bound by tlzdqs(min) on the left side and tdqsck(max) on the right side. clk# clk t lz(dqs) min dqs, dqs# late strobe dqs, dqs# early strobe t rpre t lz(dqs) max t dqsck (min) t qsh t qsl t dqsck (min) t qsh t qsl t qsh t qsl t dqsck (min) t dqsck (min) t rpst t hz(dqs) (min) bit 0 bit 1 bit 2 bit 3 bit 4 bit 5 bit 6 bit 7 t dqsck (max) t rpre t qsh t qsl t dqsck (max) t qsh t qsl t qsh t qsl t dqsck (max) t dqsck (max) t rpst t hz(dqs) (max) bit 0 bit 1 bit 2 bit 3 bit 4 bit 5 bit 6 bit 7 rl measured to this point 1gb auto-as4c64m16d3 confidential --43/86 rev.1.0 june 2015
l read timing; data strobe to data relationship the data strobe to data relationship is shown in the following figure and is applied when the dll and enabled and locked. rising data strobe edge parameters: - tdqsq d escribes the latest valid transition of the associated dq pins. - tqh describes the earliest invalid transition of the associated dq pins. falling data strobe edge parameters: - tdqsq describes the latest valid transition of the associated dq pins. - tqh d escribes the earliest invalid transition of the associated dq pins. - tdqsq; both rising/falling edges of dqs, no tac defined tdqsq; both rising/falling edges of dqs, no tac defined figure 2 0. data strobe to data relationship t1 t2 t3 t4 t5 t6 t7 t8 t9 t0 t10 rl = al +cl nop read nop nop nop nop nop nop nop nop nop bank, col n t dqsq (max) dout n dout n+1 dout n+2 dout n+3 dout n+4 dout n+5 dout n+6 dout n+7 dout n dout n+1 dout n+2 dout n+3 dout n+4 dout n+5 dout n+6 dout n+7 ck# address ck command dqs,dqs# dq (last data valid) all dqs collectively dq (first data no longer valid) t rpre t qh t qh t dqsq (max) t rpst notes 3 notes 4 notes 2 notes 2 notes: 1. bl = 8, rl = 5 (al = 0, cl = 5) 2. dout n = data-out from column n. 3. nop commands are shown for ease of illustration; other commands may be valid at these times. 4. bl8 setting activated by either mr0[a1:0 = 00] or mr0[a1:0 = 01] and a12 = 1 during read command at t0. 5. output timings are referenced to vddq/2, and dll on for locking. 6. tdqsq defines the skew between dqs,dqs# to data and does not define dqs,dqs# to clock. 7. early data transitions may not always happen at the same dq. data transitions of a dq can vary (either early or late) within a burst. don't care transitioning data dout n dout n+1 dout n+2 dout n+3 dout n+4 dout n+5 dout n+6 dout n+7 1gb auto-as4c64m16d3 confidential --44/86 rev.1.0 june 2015
write operation l ddr3 burst operation during a read or write command, ddr3 will support bc4 and bl8 on the fly using address a12 during the read or write (auto precharge can be enabled or disabled). a12=0, bc4 (bc4 = burst chop, tccd=4) a12=1, bl8 a12 is used only for burst length control, not as a column addres s. l write timing violations generally, if timing parameters are violated, a complete reset/initialization procedure has to be initiated to make sure the dram works properly. however, it is desirabl e for certain minor violations that the dram is guaranteed not to hang up and errors be limited to that particular operation. for the following, it will be assumed that there are no timing violations with regard to the write command itself (including odt , etc.) and that it does satisfy all timing requirements not mentioned below. l data setup and hold violations should the strobe timing requirements (tds, tdh) be violated, for any of the strobe edges associated with a write burst, then wrong data might be written to the memory location addressed with the offending write command. subsequent reads from that location might result in unpredictable read data, however, the dram will work properly otherwise. l strobe to strobe and strobe to clock violations should the strobe timing requirements (tdqsh, tdqsl, twpre, twpst) or the strobe to clock timing requirements (tdss, tdsh, tdqss) be violated, for any of the strobe edges associated with a write burst, then wrong data might be written to the memory location addre ssed with the offending write command. subsequent reads from that location might result in unpredictable read data, however the dram will work properly otherwise. l write timing parameters this drawing is for example only to enumerate the strobe edges that ?elong? to a write burst. no actual timing violations are shown here. for a valid burst all timing parameters for each edge of a burst need to be satisfied (not only for one edge). l refresh command the refresh command (ref) is used during normal operation of the ddr3 sdrams. this command is not persistent, so it must be issued each time a refresh is required. the ddr3 sdram requires refresh cycles at an average periodic interval of trefi. when cs# , ras# , and cas# are held low and we# high at the rising edg e of the clock, the chip enters a refresh cycle. all banks of the sdram must be precharged and idle for a minimum of the precharge time trp(min) before the refresh command can be applied. the refresh addressing is generated by the internal refresh controll er. this makes the address bits dont care during a refresh command. an internal address counter suppliers the address during the refresh cycle. no control of the external address bus is required once this cycle has started. when the refresh cycle has co mpleted, all banks of the sdram will be in the precharged (idle) state. a delay between the refresh command and the next valid command, except nop or des, must be greater than or equal to the minimum refresh cycle time trfc(min) . in general, a refresh comm and needs to be issued to the ddr3 sdram regularly every trefi interval. to allow for improved efficiency in scheduling and switching between tasks, some flexibility in the absolute refresh interval is provided. a maximum of 8 refresh commands can be postp oned during operation of the ddr3 sdram, meaning that at no point in time more than a total of 8 refresh commands are allowed to be postponed. in case that 8 refresh commands are postponed in a row, the resulting maximum interval between the surrounding re fresh commands is limited to 9 x trefi. a maximum of 8 additional refresh commands can be issued in advance (pulled in), with each one reducing the number of regular refresh commands required later by one. note that pulling in more than 8 refresh command s in advance does not further reduce the number of regular refresh commands required later, so that the resulting maximum interval between two surrounding refresh command is limited to 9 x trefi. before entering self - refresh mode, all postponed refresh com mands must be executed. 1gb auto-as4c64m16d3 confidential --45/86 rev.1.0 june 2015
l self-refresh operation the self - refresh command can be u sed to retain data in the ddr3 sdram, even if the reset of the system is powered down. when in the self - refresh mode, the ddr 3 sdram retains data without external clocking. t he ddr3 sdram device has a built - in timer to accommodate self - refresh operation. the self - refresh entry (sre) command is defined by having cs # , ras# , cas# , and cke held low with we # high at the rising edge of the clock. before issuing the self - refr eshing -e ntry command, the ddr3 sdram must be idle with all bank precharge state with trp satisfied. also, on - die termination must be turned off before issuing self - refresh - entry command, by either registering odt pin low odtl + 0.5tck prior to the self - refresh e ntry command or using mrs to mr1 command. once the self - refresh entry command is registered, cke must be held low to keep the device in self - refresh mode. during normal operation (dll on), mr1 (a0=0), the dll is automatically disabled upon entering self - re fresh and is automatically enabled (including a dll - reset) upon exiting self - refresh. when the ddr3 sdram has entered self - refresh mode, all of the external control signals, except cke and reset# , are ?ont care? for proper self - refresh operation, all power supply and reference pins (vdd, vddq, vss, vssq, vrefca, and vrefdq) must be at valid levels. the dram initiates a minimum of one refresh command internally within tcke period once it enters self - refresh mode. the clock is internally disabled during se lf- refresh operation to save power. the minimum time that the ddr3 sdram must remain in self - refresh mode is tcke. the user may change the external clock frequency or halt the external clock tcksre after self - refresh entry is registered; however, the cl ock must be restarted and stable tcksrx before the device can exit self - refresh mode. the procedure for exiting self - refresh requires a sequence of events. first, the clock must be stable prior to cke going back high. once a self - refresh exit command (srx , combinati on of cke going high and either nop or deselect on command bus) is registered, a delay of at least txs m ust be satisfied before a valid command not requiring a locked dll can be issued to the device to allow for any internal refresh in progress. before a command which requires a locked dll can be applied, a delay of at least txsdll and applicable zqcal function requirements [tbd] must be satisfied. before a command that requires a locked dll can be applied, a delay of at least txsdll must be sati sfied. depending on the system environment and the amount of time spent in self - refresh, zq calibration commands may be required to compensate for the voltage and temperature drift as described in zq calibration c ommands . to issue zq calibration comm ands, applicable timing requirements must be satisfied. cke must remain high for the entire self - refresh exit period txsdll for proper operation except for self - refresh re - entry. upon exit from self - refresh, the ddr3 sdram can be put back into self - refres h mode after waiting at least txs period and issuing one refresh command (refresh period of trfc). nop or deselect commands must be registered on each positive clock edge during the self - refresh exit interval txs. odt must be turned off during txsdll. the use of self - refresh mode instructs the possibility that an internally times refresh event can be missed when cke is raised for exit from self - refresh mode. upon ex it from self - refresh, the ddr3 sdram requires a minimum of one extra refresh command before it is put back into self - refresh mode. 1gb auto-as4c64m16d3 confidential --46/86 rev.1.0 june 2015
power-down modes l power-down entry and exit power - down is synchronously entered when cke is registered low (along with nop or deselect command). cke is not allowed to go low while mode register set command, mpr opera tions, zqcal operations, dll locking or read/write operation are in progress. cke is allowed to go low while any of other operation such as row activation, precharge or auto precharge and refresh are in progress, but power - down idd spec will not be applied until finishing those operation. the dll should be in a locked state when power - down is entered for fastest power - down exit timing. if the dll is not locked during power - down entry, the dll must be reset after exiting power - down mode for proper read opera tion and synchronous odt operation. dram design provides all ac and dc timing and voltage specification as well proper dll operation with any cke intensive operations as long as dram controller complies with dram specifications. during power - down, if all b anks are closed after any in progress commands are completed, the device will be in precharge power - down mode; if any bank is open after in progress commands are completed, the device will be in active power - down mode. entering power - down deactivates the input and output buffers, excluding ck, ck, odt, cke , and reset# . to protect dram internal delay on cke line to block the input signals, multiple nop or deselect commands are needed during the cke switch off and cycle(s) after, this timing period are defin ed as tcpded. cke_low will result in deactivation of command and address receivers after tcpded has expired. table 24. power-down entry definitions status of dram mrs bit a12 dll pd exit relevant parameters active (a bank or more open) don't care on fast txp to any valid command. precharged (all banks precharged) 0 off slow txp to any valid command. since it is in precharge state, commands here will be act, ar, mrs/emrs, pr or pra. txpdll to commands who need dll to operate, such as rd, rda or odt contro l line. precharged (all banks precharged) 1 on fast txp to any valid command. also the dll is disabled upon entering precharge power - down (slow exit mode), but the dll is kept enabled during precharge power - down (fast exit mode) or active power - down. in power - down mode, cke low, reset# high, and a stable clock signal must be mainta ined at the inputs of the dd 3 sdram, and odt should be in a valid state but all other input signals are dont care (if reset# goes low during power - down, the dram will be out of pd mode and into reset state). cke low must be maintain until tcke has been satisfied. power - down duration is limited by 9 times trefi of the device. the power - down state is synchronously exited when cke is registered high (along with a nop or deselect command).cke high must be maintained until tcke has been satisfied. a valid, executable command can be applied with power - down exit latency, txp and/or txpdll after cke goes high. power - down exit latency is defined at ac spec table of this datasheet. 1gb auto-as4c64m16d3 confidential --47/86 rev.1.0 june 2015
on-die termination (odt) odt (on - die termination) is a feature of the ddr3 sdram that allows the dram to turn on/off termination r esistance . for x16 configuration, odt is applied to each dqu, dql, dqsu, dqsu#, dqsl, dqsl#, dmu and dml signal via the odt contr ol pin. the odt feature is designed to improve signal integrity of the memory channel by allowing the dram controller to independently turn on/off termination resistance for any or all dram devices. more details about odt control modes and odt timing modes can be found further down in this document . the odt feature is turned off and not supported in self - refresh mode. a simple functional representation of the dram odt feature is shown as below. figure 21. functional representation of odt to other circuitry like rcv,... dq, dqs, dm odt vddq / 2 rtt switch the switch is enabled by the internal odt control logic, which uses the external odt pin and other control information. the value of rtt is determined by the settings of mode register bits. the odt pin will be ignored if the mode register mr1 and mr2 are programmed to disable odt and in self - refresh mode. l odt mode register and odt truth table the odt mode is enabled if either of mr1 {a2, a6, a9} or mr2 {a9, a10} are non - zero. in this case, the value of rtt is determined by the settings of those bits. application: controller sends wr command together with odt asserted. one possible application: the rank that is being written to provides termination. dram turns on termination if it sees odt asserted (except odt is disabled by mr) dram does not use any write or read command decode information. table 25. termination truth table odt pin dram termination state 0 o ff 1 on, (off, if disabled by mr1 (a2, a6, a9) and mr2 (a9, a10) in ge n eral) 1gb auto-as4c64m16d3 confidential --48/86 rev.1.0 june 2015
l synchronous odt mode synchronous odt mode is se lected whenever the dll is turned on and locked. based on th e power - down definition, these modes are: - any bank active with cke high - refresh with cke high - idle mode with cke high - active power down mode (regardless of mr0 bit a12) - precharge power d own mode if dll is enabled during precharge power down by mr0 bit a12 the direct odt feature is not supported during dll - off mode. the on - die termination resistors must be disabled by continuously registering the odt pin low and/or by programming the rtt_ nom bits mr1{a9,a6,a2} to {0,0,0} via a mode register set command during dll - off mode. in synchronous odt mode, rtt will be turned on odtlon clock cycles after odt is sampled high by a rising clock edge and turned off odtloff clock cycles after odt is regi stered low by a rising clock edge. the odt latency is tied to the write latency (wl) by : odtlon = wl - 2; odtloff = wl - 2. l odt latency and posted odt in synchronous odt mode, the additive latency (al) programmed into the mode registe r (mr1) also applies to the odt signal. the dram internal odt signal is delayed for a number of clock cycles defined by the additive latency (al) relative to the external odt signal. odtlon = cwl + al - 2; odtloff = cwl + al - 2. for details, refer to ddr3 sdram latency definitions. table 26. odt latency symbol parameter ddr3 - 1600 unit odtlon odt turn on latency wl 2 = cwl + al -2 tck odtloff odt turn off latency wl 2 = cwl + al -2 tck l timing parameters in synchronous odt mode, the following timing parameters apply: odtlon, o dtloff, taon min/max, taof min/max. minimum rtt turn - on time (taon min) is the point in time when the device leaves high impedance and odt resistance begins to turn on. maximum rtt turn - on time (taon max) is the point in time when the odt resi stance is fully on. both are measured from odtlon. minimum rtt turn - off time (taof min) is the point in time when the device starts to turn off the odt resistance. maximum rtt turn off time (taof max) is the point in time when the on - die termination has reached high impedance. both are measured from odtloff. when odt is asserted, it must remain high until odth4 is satisfied. if a wri te command is registered by the sdram with odt high, then odt must remain high until odth4 (bl=4) or odth8 (bl=8) after the write command. odth4 and odth8 are measured from odt registered high to odt registered low or from the registration of a write command until odt is registered low . l odt during reads as the ddr3 sdram cannot terminate and drive at the same time, rtt must be disabled at least half a clock cycle before the read preamble by driving the odt pin low appropriately. rtt may not be enabled until the end of the post - amble as shown in the following figure. dram turns on the termination when it stops driving which is determined by thz. if dram stops driving early (i.e. thz is early), then taonmi n time may apply. if dram stops driving late (i.e. thz is late), then dram complies with taonmax timing. note t hat odt may be disabled earlier before the read and enabled la ter after the read than shown in this example . 1gb auto-as4c64m16d3 confidential --49/86 rev.1.0 june 2015
figure 22 . odt must be disabled externally during reads by driving odt low (cl=6; al=cl - 1=5; rl=al+cl=11; cwl=5; odtlon=cwl+al - 2=8; odtloff=cwl+al - 2=8) nop read nop nop nop nop nop nop nop nop nop nop t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 ck# ck t12 t13 t14 nop nop nop don't care transitioning data t15 nop odt t16 t17 nop nop odtlon = cwl + al - 2 odtloff = cwl + al - 2 rl = al + cl t aof (min) t aof (max) t aon (max) valid rtt rtt_nom rtt_nom din b din b+1 din b+2 din b+3 din b+4 din b+5 din b+6 dq command address dqs, dqs# din b+7 l dynamic odt in certa in application cases and to further enhance signal integrity on the dat a bus, it is desirable that the termination strength of the ddr3 sdram can be changed without issuing an mrs command. this requirement is supported by the ?ynamic odt?feature as descr ibed as follows: functional description the dynamic odt mode is enabled if bit (a9) or (a10) of mr2 is set to 1. the function is described as follows: two rtt values are available: rtt_nom and rtt_wr. - the value for rtt_nom is preselected via bits a[ 9,6,2] in mr1. - the value for rtt_wr is preselected via bits a[10,9] in mr2. during operation without write commands, the termination is controlled as follows: - nominal termination strength rtt_nom is selected. - termination on/off timing is controlled via odt pin and latencies odtlon and odtloff. when a write comma nd (wr, wra, wrs4, wrs8, wras4, wras8) is registered, and if dynamic odt is enabled, the termination is controlled as follows: - a latency odtlcnw after the write command, termination streng th rtt_wr is selected. - a latency odtlcwn8 (for bl8, fixed by mrs or selected otf) or odt lcwn4 (for bc4, fixed by mrs or selected otf) after the write command, termination strength rtt_nom is selected. - termination on/off timing is controlled via odt pin and odtlon, odtloff. the following table shows latencies and timing parameters which are relevant for the on - die termination control in dynamic odt mode. the dynamic odt feature is not supported at dll - off mode. user must use mrs command to set rtt_wr, mr2 [a10,a9 = [0,0], to disable dynamic odt externally. when odt is asserted, it must remain high until odth4 is satisfied. if a write command is registered by the sdram with odt high, then odt must remain high until odth4 (bl=4) or odth8 (bl=8) after the write command. odth4 and odth8 are measured from odt registered high to odt registered low or from the registration of write command until odt is register low. 1gb auto-as4c64m16d3 confidential --50/86 rev.1.0 june 2015
table 27. latencies and timing parameters relevant for dynamic odt name and description abbr. defined from defined to definition for all ddr3 speed pin unit odt turn - on latency odtlon registering external odt signal high turning termination on odtlon=wl -2 tck odt turn - off latency odtloff registering external odt signal low turning terminati on off odtloff=wl -2 tck odt latency for changing from rtt_nom to rtt_wr odtlcnw registering external write command change rtt strength from rtt_nom to rtt_wr odtlcnw=wl -2 tck odt latency for change from rtt_wr to rtt_nom (bl=4) odtlcwn4 registering exter nal write command change rtt strength from rtt_wr to rtt_nom odtlcwn4=4+odtloff tck odt latency for change from rtt_wr to rtt_nom (bl=8) odtlcwn8 registering external write command change rtt strength from rtt_wr to rtt_nom odtlcwn8=6+odtloff tck (avg) m inimum odt high time after odt a ssertion odth4 registering odt high odt registered low odth4=4 tck (avg) minimum odt high time after write (bl=4) odth4 registering write with odt high odt registered low odth4=4 tck (avg) minimum odt high time after write (bl=8) odth8 registering write with odt high odt register low odth8=6 tck (avg) rtt change skew tadc odtlcnw odtlcwn rtt valid tadc(min)=0.3tck(avg) tadc(max)=0.7tck(avg) tck (avg) note 1 : taof,nom and tadc,nom are 0.5tck (effectively adding half a clo ck cycle to odtloff, odtcnw, and odtlcwn) l asynchronous odt mode asynchronous odt mode is selected when dram runs in dllon mode, but dll is temporarily disabled (i.e. frozen) in precharge power - down (by mr0 bit a12). based on the power down mode definition s, this is currently precharge power down mode if dll is disabled during precharge power down by mr0 bit a12. in asynchronous odt timing mode, internal odt command is not delayed by additive latency (al) relative to the external odt command. in asynchronou s odt mode, the following timing parameters apply: taonpd min/max, taofpd min/max. minimum rtt turn - on time (taonpd min) is the point in time when the device termination circuit leaves high impedance state and odt resistance begins to turn on. maximum rtt turn on time (taonpd max) is the point in time when the odt resistance is fully on. taonpd min and taonpdmax are measured from odt being sampled high. minimum rtt turn - off time (taofpdmin) is the point in time when the devices termination circuit starts to turn off the odt resistance. maximum odt turn off time (taofpdmax) is the point in time when the on - die termination has reached high imped ance. taofpdmin and taofpdmax are measured from odt being sample low. table 28. odt timing parameters for power down (with dll frozen) entry and exit description min max odt to rtt turn - on delay min{ odtlon * tck + taonmin; taonpdmin } min{ (wl - 2) * tck + taonmin; taonpdmin } max{ odtlon * tck + taonmax; taonpdmax } max{ (wl - 2) * tck + taonmax; taonpfmax } odt t o rtt turn - off delay min{ odtloff * tck + taofmin; taofpdmin } min{ (wl - 2) * tck + taofmin; taofpdmin } max{ odtloff * tck + taofmax; taofpdmax } max{ (wl - 2) * tck + taofmax; taofpdmax } tanpd wl - 1 1gb auto-as4c64m16d3 confidential --51/86 rev.1.0 june 2015
l synchronous to asynchronous odt mode transition during power-down entry if dll is selected to be frozen in precharge power down mode by the setting of bit a12 in mr0 to 0, there is a transition period around power down entry, where the ddr3 sdram may show either synchronous or asynchronous odt behavio r. the transition period is defined by the pa rameters tanpd and tcpded(min). tanpd is equal to (wl - 1) and is counted backwards in time from the clock cycle whe re cke is first registered low. tcpded(min) starts with the clock cycle where cke is first regist ered low. the transition period begins with the starting point of tanpd and terminates at the end point of tcpded(min). if there is a refresh command in progress while cke goes low, then the transition period ends at the later one of trfc(min) after the re fresh command and the end point of tcpded(min). please note that the actual starting point at tanpd is excluded from the transition period, and the actual end point at tcpded(min) and trfc(min, respectively, are included in the transition period. odt asser tion during the transition period may result in an rtt changes as early as the smaller of taonpdmin and (odtlon*tck+taonmin) and as late as the larger of taonpdmax and (odtlon*tck+taonmax). odt de - assertion during the transition period may result in an rtt change as early as the smaller of taofpdmin and (odtloff*tck+taofmin) and as late as the larger of taofpdmax and (odtloff*tck+taofmax). note that, if al has a large value, the range where rtt is uncertain becomes quite large. the following figure shows th e three different cases: odt_a, synchronous behavior before tanpd; odt_b has a state change during the transition period; odt_c shows a state change after the transition period. l asynchronous to synchronous odt mode transition during power-down exit if dll is selected to be frozen in precharge power down mode by the setting of bit a12 in mr0 to 0, there is also a transition period around power down exit, where either synchronous or asynchronous response to a change in odt must be expected from the ddr3 sd ram. this transition period starts tanpd before cke is first registered high, and ends txpdll after cke is first registered high. tanpd is equal to (wl - 1) and is counted (backwards) from the clock cycle where cke is first registered high. odt assertion du ring the transition period may result in an rtt change as early as the smaller of taonpdmin and (odtlon* tck+taonmin) and as late as the larger of taonpdmax and (odtlon*tck+taonmax). odt de - assertion during the transition period may result in an rtt change as early as the smaller of taofpdmin and (odtloff*tck+taofmin) and as late as the larger of taofpdmax and (odtoff*tck+taofmax). note that if al has a large value, the range where rtt is uncertain becomes quite large. the following figure shows the three d ifferent cases: odt_c, asynchronous response before tanpd; odt_b has a state change of odt during the transition period; odt_a shows a state change of odt after the transition period with synchronous response. l asynchronous to synchronous odt mode during s hort cke high and short cke low periods if the total time in precharge power down state or idle state is very short, the transition periods for pd entry and pd exit may overlap. in this case, the response of the ddr3 sdrams rtt to a change in odt state at the input may be synchronous or asynchronous from the state of the pd entry transition period to the end of the pd exit transition period (even if the entry ends later than the exit period). if the total time in idle state is very short, the transition per iods for pd exit and pd entry may overlap. in this case, the response of the ddr3 sdrams rtt to a change in odt state at the input may be synchronous or asynchronous from the state of the pd exit transition period to the end of the pd entry transition peri od. note that in the following figure, it is assumed that there was no refresh command in progress when idle state was entered. 1gb auto-as4c64m16d3 confidential --52/86 rev.1.0 june 2015
zq calibration commands l zq calibration description zq calibration command is used to calibrate dram ron and odt values. ddr3 sd ram needs longer time to calibrate output driver and on - die termination circuits at initialization and relatively smaller time to perform periodic calibrations. zqcl command is used to perform the initial calibration during power - up initialization sequence . this command may be issued at any time by the controller depending on the system environment. zqcl command triggers the calibration engine inside the dram and once calibration is achieved the calibrated values are transferred from calibration engine to d ram io which gets reflected as updated output driver and on - die termination values. the first zqcl command issued after reset is allowed a timing period of tzqinit to perform the full calibration and the transfer of values. all other zqcl commands except t he first zqcl command issued after reset is allowed a timing period of tzqoper. zqcs command is used to perform periodic calibrations to account for voltage and temperature variations. a shorter timing window is provided to perform the calibration and tran sfer of values as defined by timing parameter tzqcs. no other activities should be performed on the dram channel by the controller for the duration of tzqinit, tzqoper, or tzqcs. the quiet time on the dram channel allows calibration of output driver and on - die termination values. once dram calibration is achieved, the dram should disable zq current consumption path to reduce power. all banks must be precharged and trp met before zqcl or zqcs commands are issued by the controller. zq calibration commands can also be issued in parallel to dll lock time when coming out of self refresh. upon self - refresh exit, ddr3/l sdram will not perform an io calibration without an explicit zq calibration command. the earliest possible time for zq calibration command (short o r long) after self refresh exit is txs. in systems that share the zq resistor between devices, the controller must not allow any overlap of tzqoper, tzqinit, or tzqcs between ranks. figure 23. zq calibration timing ck# t1 ta0 ta1 ta2 ta3 t0 ck cke nop zqcl nop valid t zqinit or t zqoper don't care time break valid tb0 tb1 zqcs nop t zqcs tc0 tc1 nop nop address notes: 1. cke must be continuously registered high during the calibration procedure. 2. on-die termination must be disabled via the odt signal or mrs during the calibration procedure. 3. all devices connected to the dq bus should be high impedance during the calibration procedure. tc2 nop valid valid valid valid a10 valid valid valid valid valid valid notes 1 odt valid valid valid notes 2 hi-z activities hi-z notes 3 command dq bus activities notes 1 notes 2 notes 3 l zq external resistor value, tolerance, and capacitive loading in order to use the zq calibration function, a 240 ohm +/ - 1 % tolerance external resistor connected between the zq pin and ground. the single resistor can be used for each sdram or one resistor can be shared between two sdrams if the zq calibration timings for each sdram do not overlap. the total capacitive loading on the zq pin must be limited. 1gb auto-as4c64m16d3 confidential --53/86 rev.1.0 june 2015
- single-ended requirements for differential signals each individual component of a differential signal (ck, ck# , l dqs, u dqs, l dqs# , or u dqs# ) has also to comply with certain requirements for single - ended signals. ck and ck# have to approximately reach vsehmin / vselmax (approximately equal to the ac - levels (vih(ac) / vil(ac)) for add/cmd signals ) in every half - cycle. l dqs , u dqs , ldqs# , udqs# have to reach vsehmin / vselmax (approximately the ac - levels (vih(ac) / vil(ac)) for dq signals) in every half - cycle proceeding and following a valid transition. note that the applicable ac - levels for add/cmd and dq? might be different per speed - bin etc. e.g., if vih150(ac)/vil150(ac) is used for add/cmd signals, then these ac - levels apply also for the single - ended signals ck and ck# . table 2 9. single-ended levels for ck, dqsl, dqsu, ck#, dqsl# or dqsu# symbol parameter mi n. max. unit note vseh single - ended high level for strobes (v dd / 2) + 0.175 note 3 v 1,2 single - ended high level for ck, ck# (v dd / 2) + 0.175 note 3 v 1,2 vsel single - ended low level for strobes note 3 (v dd / 2) - 0.175 v 1,2 single - ended low level for ck, ck# note 3 (v dd / 2) - 0.175 v 1,2 note 1 : for ck, ck# use vih/vil(ac) of add/cmd; for strobes (dqsl, dqsl#, dqsu, dqsu#) use vih/vil(ac) of dqs. note 2 : vih(ac)/vil(ac) for dqs is based on vrefdq; vih(ac)/vil(ac) for add/cmd is based on vrefca; if a reduced ac - high or ac - low level is used for a signal group, then the reduced level applies also here . note 3 : these values are not defined, however the single - ended signals ck, ck#, dqsl, dqsl#, dqsu, dqsu# need to be within the respective limits (vih (dc) max, vil(dc)min) for single - ended signals as well as the limitations for overshoot and undershoot. - differential input cross point voltage to guarantee tight setup and hold times as well as output skew parameters with respect to clock and strobe, e ach cross point voltage of differential input signals (ck, ck # and dqs, dqs # ) must meet the requirements in the following table. the differential input cross point voltage vix is measured from the actual cross point of true and complete signal to the midle vel between of vdd and vss. table 30. cross point voltage for differential input signals (ck, dqs) symbol parameter min. max. unit note vix(ck) differential input cross point voltage relative to vdd/2 for ck, ck# - 150 150 mv 2 - 175 175 mv 1 vix(dqs ) differential input cross point voltage relative to vdd/2 for dqs, dqs# - 150 150 mv 2 note 1 : extended range for vix is only allowed for clock and if single - ended clock input signals ck and ck# are monotonic with a single - ended swing vsel / vseh of at least vdd/2 +/ - 250 mv, and when the differential slew rate of ck - ck# is larger than 3 v/ns. note 2 : the relation between vix min/max and vsel/vseh should satisfy following. (vdd/2) + vix (min) - vsel R 25mv vseh - ((vdd/2) + vix (max)) R 25mv 1gb auto-as4c64m16d3 confidential --54/86 rev.1.0 june 2015
- slew rate definition for differential input signals input slew rate for differential signals (ck, ck# and dqs, dqs#) are defined and measured as shown below. table 31. differential input slew rate definition description measured defined by from to di fferential input slew rate for rising edge (ck , ck# and dqs , dqs# ) vildiffmax vihdiffmin [vihdiffmin - vildiffmax] / deltatrdiff differential input slew rate for falling edge (ck , ck# and dqs , dqs# ) vihdiffmin vildiffmax [vihdiffmin - vildiffmax] / deltatfdif f note: the differential signal (i.e., ck , ck# and dqs , dqs#) must be linear between these thresholds. table 32. single-ended ac and dc output levels symbol parameter - 12 unit note v oh (dc) dc output high measurement level (for iv curve linearity) 0.8 x v ddq v v om (dc) dc output mid measurement level (for iv curve linearity) 0.5 x v ddq v v ol (dc) dc output low measurement level (for iv curve linearity) 0.2 x v ddq v v oh (ac) ac output high measurement level (for output sr) v tt + 0.1 x v ddq v 1 v ol (ac ) ac output low measurement level (for output sr) v tt - 0.1 x v ddq v 1 note 1: the swing of 0.1 vddq is based on approximately 50% of the static single - ended output high or low swing with a driver impedance of 40 and an effective test load of 25 t o vtt = vddq/2. table 33. differential ac and dc output levels symbol parameter - 12 unit note v ohdiff (ac) ac differential output high measurement level (for output sr) + 0.2 x v ddq v 1 v oldiff (ac) ac differential output low measurement level (for ou tput sr) - 0.2 x v ddq v 1 note 1 : the swing of 0.2 vddq is based on approximately 50% of the static single - ended output high or low swing with a driver impedance of 40 and an effective test load of 25 to vtt = vddq/2 at each of the differential outputs. 1gb auto-as4c64m16d3 confidential --55/86 rev.1.0 june 2015
- single ended output slew rate with the reference load for timing measurements, output slew rate for falling and rising edges is defined and measured between vol( ac) and voh(ac) for single ended signals as shown in table . table 34. output slew rate definition (single-ended ) description measured defined by from to single - ended output slew rate for rising edge vol(ac) voh(ac) [voh(ac) - vol(ac)] / deltatrse sin gle - ended output slew rate for fall ing edge voh(ac) vol(ac) [voh(ac) - vol(ac)] / deltat f se note: output slew rate is verified by design and characterization, and may not be subject to production test. table 35. output slew rate (single-ended) symbol pa rameter - 12 unit min. max. srqse single - ended output slew rate 2.5 5 v/ns description: sr: slew rate q: query output (like in dq, which stands for data - in, query - output) se: single - ended signals for ron = rzq/7 setting - differential output slew rate with the reference load for timing measurements, output slew rate for falling and rising edges is defined and measured between voldiff(ac) and vohdiff(ac) for differential signals as shown in table. table 36. output slew rate definition (differential) description measured defined by from to differential output slew rate for rising edge voldiff(ac) vohdiff(ac) [vohdiff(ac) - voldiff(ac)] / deltatrdiff differential output slew rate for fall ing edge vohdiff(ac) voldiff(ac) [vohdiff(ac) - voldiff(ac)] / deltat f diff note: output slew rate is verified by design and characterization, and may not be subject to production test . table 37. output slew rate (differential) symbol parameter - 12 unit min. max. srq diff differential output slew rate 5 10 v/ ns description: sr: slew rate q: query output (like in dq, which stands for data - in, query - output) diff: differential signals for ron = rzq/7 setting 1gb auto-as4c64m16d3 confidential --56/86 rev.1.0 june 2015
l reference load for ac timing and output slew rate the following figure represents the effective reference load of 25 ohms used in defining the relevant ac timing parameters of the device as well as output slew rate measurements. it is not intended as a precise representation of any particular system environment or a depiction of the actual load presented by a production tester. system designers should use ibis or other simulation tools to correlate the timing reference load to a system environment. manufacturers correlate to their production test conditions, generally one or more coaxial transmission lines terminated at the tester electronics. figure 24. reference load for ac timing and output slew rate dut dq dqs dqs# vddq ck, ck# 25 ohm vtt = vddq/2 table 38. ac overshoot/undershoot specification for address and control pins parameter - 12 unit maximum peak amplit ude allowed for overshoot area. 0.4 v maximum peak amplitude allowed for undershoot area. 0.4 v maximum overshoot area above vdd 0.33 v- ns maximum undershoot area below vss 0.33 v- ns table 39. ac overshoot/undershoot specification for clock, data, strobe and mask parameter - 12 unit maximum peak amplitude allowed for overshoot area. 0.4 v maximum peak amplitude allowed for undershoot area. 0.4 v maximum overshoot area above vdd 0.13 v- ns maximum undershoot area below vss 0.13 v- ns 1gb auto-as4c64m16d3 confidential --57/86 rev.1.0 june 2015
- address / command setup, hold and derating for all input signals the total tis (setup time) and tih (hold time) required is calculated by adding the data sheet tis(base) and tih(base) and tih(base) value to the delta tis and delta tih derating value respectivel y. example: tis (total setup time) = tis(base) + delta tis . setup (tis) nominal slew rate for a rising signal is defined as the slew rate between the last crossing of vref(dc) and the first crossing of vih(ac)min. setup (tis) nominal slew rate for a fallin g signal is defined as the slew rate between the last crossing of vref(dc) and the first crossing of vil(ac)max. if the actual signal is always earlier than the nominal slew rate line between shaded vref(dc) to ac region, use nominal slew rate for derating value. if the actual signal is later than the nominal slew rate line anywhere between shaded vref(dc) to ac region, the slew rate of the tangent line to the actual signal from the ac level to dc level is used for derating value. hold (tih) nominal slew rate for a rising signal is defined as the slew rate between the last crossing of vil(dc)max and the first crossing of vref(dc). hold (tih) nominal slew rate for a falling signal is defined as the slew rate between the last crossing of vih(dc)min and the first crossing of vref(dc). if the actual signal is always later than the nominal slew rate line between shaded dc to vref(dc) region, use nominal slew rate for derating value. if the actual signal is earlier than the nominal slew rate line anywhere bet ween shaded dc to vref(dc) region, the slew rate of a tangent line to the actual signal from the dc level to vref(dc) level is used for derating value. for a valid transition the input signal has to remain above/below vih/il(ac) for some time tvac. although for slow slew rates the total setup time might be negative (i.e. a valid input signal will not have reached vih/il(ac) at the time of the rising clock transition) a valid input signal is still required to complete the transition and reach vih/il(ac). table 40. add/cmd setup and hold base - values for 1v/ns symbol reference - 12 unit t is (base) ac175 v ih/l (ac) 45 ps t is (base) ac150 v ih/l (ac) 170 ps t ih (base) dc100 v ih/l (dc) 120 ps note 1 : (ac/dc referenced for 1v/ns address/command slew rate and 2 v/ ns differential ck - ck# slew rate) note 2 : the tis(base) ac150 specifications are adjusted from the tis(base) ac175 specification by adding an additional 100ps of derating to accommodate for the lower alternate threshold of 150 mv and another 25 ps to account for the earlier reference point [(175 mv - 150 mv) / 1 v/ns]. table 41. derating values ddr3-1600 tis/tih ?( ac175) t i s , t ih derating in [ps] ac/dc based ac175 threshold - > v ih (ac)=v ref (dc)+175mv, v il (ac)=v ref (dc) - 175mv ck, ck# differential slew rate 4.0 v/ns 3.0 v/ns 2.0 v/ns 1.8 v/ns 1.6 v/ns 1.4 v/ns 1.2 v/ns 1.0 v/ns tis tih tis tih tis tih tis tih tis tih tis tih tis tih tis tih cmd /ad d slew rate v/ns 2.0 88 50 88 50 88 50 96 58 104 66 112 74 120 84 128 100 1.5 59 34 59 34 59 34 67 42 75 50 83 58 91 68 99 84 1.0 0 0 0 0 0 0 8 8 16 16 24 24 32 34 40 50 0.9 -2 -4 -2 -4 -2 -4 6 4 14 12 22 20 30 30 38 46 0.8 -6 - 10 -6 - 10 -6 - 10 2 -2 10 6 18 14 26 24 34 40 0.7 - 11 - 16 - 11 - 16 - 11 - 16 -3 -8 5 0 13 8 21 18 29 34 0.6 - 17 - 26 - 17 - 26 - 17 - 26 -9 - 18 -1 - 10 7 -2 15 8 23 24 0.5 - 35 - 40 - 35 - 40 - 35 - 40 - 27 - 32 - 19 - 24 - 11 - 16 -2 -6 5 10 0.4 - 62 - 60 - 62 - 60 - 62 - 60 - 54 - 52 - 46 - 44 - 38 - 36 - 30 - 26 - 22 - 10 1gb auto-as4c64m16d3 confidential --58/86 rev.1.0 june 2015
table 42. derating values ddr3-1600 tis/tih ?( ac150) t i s , t ih derating in [ps] ac/dc based alternate ac15 0 threshold - > v ih (ac)=v ref (dc)+1 50 mv, v il (ac)=v ref (dc) -1 50mv ck, ck# differential slew rate 4.0 v/ns 3.0 v/ns 2.0 v/ns 1.8 v/ns 1.6 v/ns 1.4 v/ns 1.2 v/ns 1.0 v/ns tis tih tis tih tis tih tis tih tis tih tis tih tis tih tis tih cmd /ad d slew rate v/ns 2.0 75 50 75 50 75 50 83 58 91 66 99 74 107 84 115 100 1.5 50 34 50 34 50 34 58 42 66 50 74 58 82 68 90 84 1.0 0 0 0 0 0 0 8 8 16 16 24 24 32 34 40 50 0.9 0 -4 0 -4 0 -4 8 4 16 12 24 20 32 30 40 46 0.8 0 - 10 0 - 10 0 - 10 8 -2 16 6 24 14 32 24 40 40 0.7 0 - 16 0 - 16 0 - 16 8 -8 16 0 24 8 32 18 40 34 0.6 -1 - 26 -1 - 26 -1 - 26 7 - 18 15 - 10 23 -2 31 8 39 24 0.5 - 10 - 40 - 10 - 40 - 10 - 40 -2 - 32 6 - 24 14 - 16 22 -6 30 10 0.4 - 25 -60 - 25 - 60 - 25 - 60 - 17 - 52 -9 - 44 -1 - 36 7 - 26 15 - 10 1gb auto-as4c64m16d3 confidential --59/86 rev.1.0 june 2015
- data setup, hold, and slew rate de-rating for all input signals the total tds (setup time) and tdh (hold time) required is calculated by adding the data sheet tds(base) and tdh(base) value to the tds and tdh derating value respectively. example: tds (total setup time) = tds(base) + tds. setup (tds) nominal slew rate for a rising signal is defined as the slew rate between the last crossing of vref(dc) and the first crossing of vih(ac)min. setup (tds) nominal slew rate for a falling signal is defined as the slew rate between the last crossing of vref(dc) and the first crossing of vil(ac)max. if the actual signal is always earlier than the nominal slew rate line between shaded vref(dc) to ac regio n, use nominal slew rate for derating value. if the actual signal is later than the nominal slew rate line anywhere between shaded vref(dc) to ac region, the slew rate of the tangent line to the actual signal from the ac level to dc level is used for de rating value. hold (tdh) nominal slew rate for a rising signal is defined as the slew rate between the last crossing of vil(dc)max and the first crossing of vref(dc). hold (tdh) nominal slew rate for a falling signal is defined as the slew rate between the last crossing of vih(dc)min and the first crossing of vref(dc). if the actual signal is always later than the nominal slew rate line between shaded dc level to vref(dc) region, use nominal slew rate for derating value. if the actual signal is earlier th an the nominal slew rate line anywhere between shaded dc to vref(dc) region, the slew rate of a tangent line to the actual signal from the dc level to vref(dc) level is used for derating value. for a valid transition the input signal has to remain above/ below vih/il(ac) for some time tvac. although for slow slew rates the total setup time might be negative (i.e. a valid input signal will not have reached vih/il(ac) at the time of the rising clock transition) a valid input signal is still required to compl ete the transition and reach vih/il(ac). for slew rates in between the values listed in the following tables, the derating values may be obtained by linear interpolation. these values are typically not subject to production test. they are verified by desig n and characterization. table 43. data setup and hold base - values for 1v/ns symbol reference - 12 unit t ds (base) ac150 v ih/l (ac) 10 ps t dh (base) dc100 v ih/l (d c) 45 ps note 2: (ac/dc referenced for 1 v/ns dq - slew rate and 2 v/ns differential dqs slew rate) table 44. derating values for ddr3-1600 tds/tdh ?(ac150) t d s , t dh derating in [ps] ac/dc based dqs , dqs# differential slew rate 4.0 v/ns 3.0 v/ns 2.0 v/ns 1.8 v/ns 1.6 v/ns 1.4 v/ns 1.2 v/ns 1.0 v/ns tds tdh tds tdh tds tdh tds tdh tds tdh tds tdh tds tdh tds tdh dq slew rate v/ns 2.0 75 50 75 50 75 50 - - - - - - - - - - 1.5 50 34 50 34 50 34 58 42 - - - - - - - - 1.0 0 0 0 0 0 0 8 8 16 16 - - - - - - 0.9 - - 0 -4 0 -4 8 4 16 12 24 20 - - - - 0.8 - - - - 0 - 10 8 -2 16 6 24 14 32 24 - - 0.7 - - - - - - 8 -8 16 0 24 8 32 18 40 34 0.6 - - - - - - - - 15 - 10 23 -2 31 8 39 24 0.5 - - - - - - - - - - 14 - 16 22 -6 30 10 0.4 - - - - - - - - - - - - 7 - 26 15 - 10 1gb auto-as4c64m16d3 confidential --60/86 rev.1.0 june 2015
timing waveforms figure 2 5. mpr readout of predefined pattern,bl8 fixed burst order, single readout don't care time break mrs prea read nop nop nop nop nop nop nop nop mrs t rp notes: 1. rd with bl8 either by mrs or otf. 2. memory controller must drive 0 on a[2:0]. t0 ta tb0 tb1 tc0 tc1 tc2 tc3 tc4 tc5 tc6 tc7 ck# ck ba a[1:0] a[2] a[11] a12, bc# a[9:3] a10, ap tc8 tc9 td mrs mrs valid t mod notes 1 t mprr t mod 3 valid 3 0 0 valid 1 0 0 00 valid 00 0 valid 0 0 valid 0 0 valid 0 0 valid 0 a[15:13] dq 1 rl notes 2 notes 2 dqs, dqs# command figure 2 6. mpr readout of predefined pattern,bl8 fixed burst order, back to back radout don't care time break mrs prea read read nop nop nop nop nop nop nop nop t rp notes: 1. rd with bl8 either by mrs or otf. 2. memory controller must drive 0 on a[2:0]. t0 ta tb tc0 tc1 tc2 tc3 tc4 tc5 tc6 tc7 tc8 ck# ck ba a[1:0] a[2] a[11] a12, bc# a[9:3] a10, ap tc9 tc10 td nop mrs valid t mod notes 1 t mprr t mod 3 valid 3 0 0 valid 1 0 0 00 valid 00 0 valid 0 0 valid 0 0 valid 0 0 valid 0 a[15:13] dq 1 rl notes 2 notes 2 notes 1 t ccd valid 0 0 valid valid valid valid valid notes 2 notes 1 notes 1 notes 2 dqs, dqs# command rl 1gb auto-as4c64m16d3 confidential --61/86 rev.1.0 june 2015
figure 2 7. mpr readout of predefined pattern,bc4 lower nibble then upper nibble don't care time break mrs prea read read nop nop nop nop nop nop nop mrs t rp notes: 1. rd with bc4 either by mrs or otf. 2. memory controller must drive 0 on a[1:0]. 3. a[2]=0 selects lower 4 nibble bits 0....3. 4. a[2]=1 selects upper 4 nibble bits 4....7. t0 ta tb tc0 tc1 tc2 tc3 tc4 tc5 tc6 tc7 tc8 ck# ck ba a[1:0] a[2] a[11] a12, bc# a[9:3] a10, ap tc9 tc10 td nop nop valid t mod notes 1 t mprr t mod 3 valid 3 0 0 valid 1 0 0 00 valid 00 0 valid 0 0 valid 0 0 valid 0 0 valid 0 a[15:13] dq 1 rl notes 2 notes 3 notes 1 t ccd valid 0 1 valid valid valid valid valid notes 2 notes 1 notes 1 notes 4 dqs, dqs# command rl figure 2 8. mpr readout of predefined pattern,bc4 upper nibble then lower nibble don't care time break mrs prea read read nop nop nop nop nop nop nop mrs t rp notes: 1. rd with bc4 either by mrs or otf. 2. memory controller must drive 0 on a[1:0]. 3. a[2]=0 selects lower 4 nibble bits 0....3. 4. a[2]=1 selects upper 4 nibble bits 4....7. t0 ta tb tc0 tc1 tc2 tc3 tc4 tc5 tc6 tc7 tc8 ck# ck ba a[1:0] a[2] a[11] a12, bc# a[9:3] a10, ap tc9 tc10 td nop nop valid t mod notes 1 t mprr t mod 3 valid 3 0 0 valid 1 1 0 00 valid 00 0 valid 0 0 valid 0 0 valid 0 0 valid 0 a[15:13] dq 1 rl notes 2 notes 4 notes 1 t ccd valid 0 0 valid valid valid valid valid notes 2 notes 1 notes 1 notes 3 dqs, dqs# command rl 1gb auto-as4c64m16d3 confidential --62/86 rev.1.0 june 2015
figure 29 . read (bl8) to read (bl8) nop read nop nop read nop nop nop nop nop nop nop notes: 1. bl8, rl = 5 (cl = 5, al = 0) 2. dout n (or b) = data-out from column n (or column b). 3. nop commands are shown for ease of illustration; other commands may be valid at these times. 4. bl8 setting activated by either mr0[a1:0 = 00] or mr0[a1:0 = 01] and a12 = 1 during read commands at t0 and t4. t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 ck# ck dq t12 t13 t14 nop nop nop t ccd notes 3 notes 4 bank, col n bank, col b dout n dout n+1 dout n+2 dout n+3 dout n+4 dout n+5 dout n+6 dout n+7 dout b dout b+1 dout b+2 dout b+3 dout b+4 dout b+5 dout b+6 dout b+7 t rpst t rpre rl = 5 rl = 5 don't care transitioning data notes 2 dqs, dqs# address command figure 3 0. nonc onsecutive read (bl8) to read (bl8) nop read nop nop nop read nop nop nop nop nop nop notes: 1. bl8, rl = 5 (cl = 5, al = 0), tccd=5 2. dout n (or b) = data-out from column n (or column b) 3. nop commands are shown for ease of illustration; other commands may be valid at these times 4. bl8 setting activated by either mr0[a1:0 = 00] or mr0[a1:0 = 01] and a12 = 1 during read commands at t0 and t4 5. dqs-dqs# is held logic low at t9 t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 ck# ck dq t12 t13 t14 nop nop nop t ccd = 5 notes 3 notes 4 bank, col n bank, col b do n do b t rpst t rpre rl = 5 rl = 5 don't care transitioning data notes 2 dqs, dqs# address command notes 5 figure 3 1. read (bl4) to read (bl4) nop read nop nop read nop nop nop nop nop nop nop notes: 1. bc4, rl = 5 (cl = 5, al = 0) 2. dout n (or b) = data-out from column n (or column b). 3. nop commands are shown for ease of illustration; other commands may be valid at these times. 4. bc4 setting activated by either mr0[a1:0 = 10] or mr0[a1:0 = 01] and a12 = 0 during read commands at t0 and t4. t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 ck# ck dq t12 t13 t14 nop nop nop t ccd notes 3 notes 4 bank, col n bank, col b dout n dout n+1 dout n+2 dout n+3 dout b dout b+1 dout b+2 dout b+3 t rpre rl = 5 rl = 5 don't care transitioning data notes 2 dqs, dqs# address command t rpst t rpst t rpre 1gb auto-as4c64m16d3 confidential --63/86 rev.1.0 june 2015
figure 3 2. read (bl8) to write (bl8) nop read nop nop nop read nop nop nop nop nop nop notes: 1. bl8, rl = 5 (cl = 5, al = 0), tccd=5 2. dout n (or b) = data-out from column n (or column b) 3. nop commands are shown for ease of illustration; other commands may be valid at these times 4. bl8 setting activated by either mr0[a1:0 = 00] or mr0[a1:0 = 01] and a12 = 1 during read commands at t0 and t4 5. dqs-dqs# is held logic low at t9 t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 ck# ck dq t12 t13 t14 nop nop nop t ccd = 5 notes 3 notes 4 bank, col n bank, col b do n do b t rpst t rpre rl = 5 rl = 5 don't care transitioning data notes 2 dqs, dqs# address command notes 5 figure 3 3. read (bl4) to write (bl4) otf nop read nop nop write nop nop nop nop nop nop nop notes: 1. bc4, rl = 5 (cl = 5, al = 0), wl = 5 (cwl = 5, al = 0) 2. dout n = data-out from column, din b = data-in from column b. 3. nop commands are shown for ease of illustration; other commands may be valid at these times. 4. bc4 setting activated by mr0[a1:0 = 01] and a12 = 0 during read command at t0 and write command at t4. t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 ck# ck dq t12 t13 t14 nop nop nop read to write command delay = rl + tccd/2 + 2tck - wl notes 3 notes 4 bank, col n bank, col b dout n dout n+1 dout n+2 dout n+3 din b din b+1 din b+2 din b+3 t rpre rl = 5 wl = 5 don't care transitioning data notes 2 dqs, dqs# address command t rpst t wpre t15 nop t wpst 4 clocks t wr t wtr figure 3 4. read (bl8) to read (bl4) otf nop read nop nop read nop nop nop nop nop nop nop notes: 1. rl = 5 (cl = 5, al = 0) 2. dout n (or b) = data-out from column n (or column b). 3. nop commands are shown for ease of illustration; other commands may be valid at these times. 4. bl8 setting activated by mr0[a1:0 = 01] and a12 = 1 during read command at t0. bc4 setting activated by mr0[a1:0 = 01] and a12 = 0 during read command at t4. t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 ck# ck dq t12 t13 t14 nop nop nop t ccd notes 3 notes 4 bank, col n bank, col b dout n dout n+1 dout n+2 dout n+3 dout b dout b+1 dout b+2 dout b+3 t rpre rl = 5 rl = 5 don't care transitioning data notes 2 dqs, dqs# address command t rpst dout n+4 dout n+5 dout n+6 dout n+7 1gb auto-as4c64m16d3 confidential --64/86 rev.1.0 june 2015
figure 3 5. read (bl4) to read (bl8) otf nop read nop nop read nop nop nop nop nop nop nop notes: 1. rl = 5 (cl = 5, al = 0) 2. dout n (or b) = data-out from column n (or column b). 3. nop commands are shown for ease of illustration; other commands may be valid at these times. 4. bc4 setting activated by mr0[a1:0 = 01] and a12 = 0 during read command at t0. bl8 setting activated by mr0[a1:0 = 01] and a12 = 1 during read command at t4. t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 ck# ck dq t12 t13 t14 nop nop nop t ccd notes 3 notes 4 bank, col n bank, col b dout n dout n+1 dout n+2 dout n+3 dout b+4 dout b+5 dout b+6 dout b+7 t rpre rl = 5 rl = 5 don't care transitioning data notes 2 dqs, dqs# address command t rpst dout b dout b+1 dout b+2 dout b+3 t rpst t rpre figure 36. r ead (bc4) to write (bl8) otf nop read nop nop write nop nop nop nop nop nop nop notes: 1. bc4, rl = 5 (cl = 5, al = 0), wl = 5 (cwl = 5, al = 0) 2. dout n = data-out from column, din b = data-in from column b. 3. nop commands are shown for ease of illustration; other commands may be valid at these times. 4. bc4 setting activated by mr0[a1:0 = 01] and a12 = 0 during read command at t0 and write command at t4. t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 ck# ck dq t12 t13 t14 nop nop nop read to write command delay = rl + tccd/2 + 2tck - wl notes 3 notes 4 bank, col n bank, col b dout n dout n+1 dout n+2 dout n+3 din b din b+1 din b+2 din b+3 t rpre rl = 5 wl = 5 don't care transitioning data notes 2 dqs, dqs# address command t rpst t wpre t15 nop t wpst 4 clocks t wr t wtr din b+4 din b+5 din b+6 din b+7 figure 37. read (bl8) to write (bl4) otf nop read nop nop nop nop write nop nop nop nop nop notes: 1. rl = 5 (cl = 5, al = 0), wl = 5 (cwl= 5, al = 0) 2. dout n = data-out from column, din b = data-in from column b. 3. nop commands are shown for ease of illustration; other commands may be valid at these times. 4. bl8 setting activated by mr0[a1:0 = 01] and a12 = 1 during read command at t0. bc4 setting activated by mr0[a1:0 = 01] and a12 = 0 during write command at t6. t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 ck# ck dq t12 t13 t14 nop nop nop read to write command delay = rl + tccd + 2tck - wl notes 3 notes 4 bank, col n bank, col b dout n dout n+1 dout n+2 dout n+3 din b din b+1 din b+2 din b+3 t rpre rl = 5 wl = 5 don't care transitioning data notes 2 dqs, dqs# address command t rpst t wpre t15 nop t wpst dout n+4 dout n+5 dout n+6 dout n+7 4 clocks t wr t wtr 1gb auto-as4c64m16d3 confidential --65/86 rev.1.0 june 2015
figure 38. read to precharge, rl = 5, al = 0, cl = 5, trtp = 4, trp = 5 read nop nop nop nop pre nop nop nop nop act nop notes: 1. rl = 5 (cl = 5, al = 0) 2. dout n = data-out from column n. 3. nop commands are shown for ease of illustration; other commands may be valid at these times. 4. the example assumes tras.min is satisfied at precharge command time (t5) and that trc.min is satisfied at the next active command time (t10). t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 ck# ck dq t12 t13 t14 nop nop nop rl = al + cl bank a, (or all) bank a, row b do n do n+1 do n+2 do n+3 don't care transitioning data t15 nop t rp t rtp bank a, col n dq do n do n+1 do n+2 do n+3 bl4 operation: bl8 operation: do n+4 do n+5 do n+6 do n+7 dqs, dqs# dqs, dqs# address command figure 3 9. read to precharge, rl = 8, al = cl-2, cl = 5, trtp = 6, trp = 5 read nop nop nop nop nop nop nop nop nop pre nop notes: 1. rl = 8 (cl = 5, al = cl - 2) 2. dout n = data-out from column n. 3. nop commands are shown for ease of illustration; other commands may be valid at these times. 4. the example assumes tras.min is satisfied at precharge command time (t10) and that trc.min is satisfied at the next active command time (t15). t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 ck# ck dq t12 t13 t14 nop nop nop al = cl - 2 = 3 bank a, (or all) do n do n+1 do n+2 do n+3 don't care transitioning data t15 act t rtp bank a, col n dq do n do n+1 do n+2 do n+3 bl4 operation: bl8 operation: do n+4 do n+5 do n+6 do n+7 bank a, row b cl = 5 t rp dqs, dqs# dqs, dqs# address command 1gb auto-as4c64m16d3 confidential --66/86 rev.1.0 june 2015
figure 4 0. write timing definition and parameters nop write nop nop nop nop nop nop nop nop nop notes: 1. bl8, wl = 5 (al = 0, cwl = 5) 2. din n = data-in from column n. 3. nop commands are shown for ease of illustration; other commands may be valid at these times. 4. bl8 setting activated by either mr0[a1:0 = 00] or mr0[a1:0 = 01] and a12 = 1 during write command at t0. 5. tdqss must be met at each rising clock edge. t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 ck# ck dq wl = al + cwl din n din n+2 din n+3 don't care transitioning data bank col n dm notes 3 notes 4 notes 2 t dqss(min) t wpre(min) t dqsh(min) t dqsl t dqss t dsh t dqsh t dqsl t dqsh t dqsl t dqsh t dqsl t dqsh t dqsl(min) t dsh t dsh t wpst(min) t dss t dss t dss t dss t dss din n+4 din n+6 din n+7 dq din n din n+2 din n+3 dm notes 2 t dqss(nominal) t wpre(min) t dqsh(min) t dqsl t dsh t dqsh t dqsl t dqsh t dqsl t dqsh t dqsl t dqsh t dqsl(min) t dsh t dsh t dsh t wpst(min) t dss t dss t dss t dss t dss din n+4 din n+6 din n+7 t dsh dq din n din n+2 din n+3 dm notes 2 t dqss(max) t wpre(min) t dqsh(min) t dqsl t dsh t dqsh t dqsl t dqsh t dqsl t dqsh t dqsl t dqsh t dqsl(min) t dsh t dsh t dsh t wpst(min) t dss t dss t dss t dss t dss din n+4 din n+6 din n+7 t dqss command address dqs, dqs# dqs, dqs# dqs, dqs# 1gb auto-as4c64m16d3 confidential --67/86 rev.1.0 june 2015
figure 4 1. write burst operation wl = 5 (al = 0, cwl = 5, bl8) nop write nop nop nop nop nop nop nop nop nop notes: 1. bl8, wl = 5; al = 0, cwl = 5. 2. din n = data-in from column n. 3. nop commands are shown for ease of illustration; other commands may be valid at these times. 4. bl8 setting activated by either mr0[a1:0 = 00] or mr0[a1:0 = 01] and a12 = 1 during write command at t0. t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 ck# ck dq wl = al + cwl din n din n+1 din n+2 din n+3 don't care transitioning data t wpre bank, col n notes 2 din n+4 din n+5 din n+6 din n+7 dqs, dqs# command address notes 3 notes 4 t wpst figure 4 2. write burst operation wl = 9 (al = cl-1, cwl = 5, bl8) nop write nop nop nop nop nop nop nop nop nop notes: 1. bl8, wl = 9; al = (cl - 1), cl = 5, cwl = 5. 2. din n = data-in from column n. 3. nop commands are shown for ease of illustration; other commands may be valid at these times. 4. bl8 setting activated by either mr0[a1:0 = 00] or mr0[a1:0 = 01] and a12 = 1 during write command at t0. t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 ck# ck dq al = 4 din n din n+1 din n+2 din n+3 don't care transitioning data t wpre bank, col n notes 2 notes 3 notes 4 dqs, dqs# address command cwl = 5 wl = al + cwl 1gb auto-as4c64m16d3 confidential --68/86 rev.1.0 june 2015
figure 4 3. write(bc4) to read (bc4) operation nop write nop nop nop nop nop nop nop nop read notes: 1. bc4, wl = 5, rl = 5. 2. din n = data-in from column n. 3. nop commands are shown for ease of illustration; other commands may be valid at these times. 4. bc4 setting activated by mr0[a1:0 = 10] during write command at t0 and read command at tn. 5. twtr controls the write to read delay to the same device and starts with the first rising clock edge after the last write data shown at t7. t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 tn ck# ck dq din n din n+1 din n+2 din n+3 don't care transitioning data bank, col n notes 2 dqs, dqs# command address notes 3 notes 4 t wpst t wtr wl = 5 rl = 5 time break notes 5 t wpre figure 44. write(bc4) to precharge operation nop write nop nop nop nop nop nop nop nop pre notes: 1. bc4, wl = 5, rl = 5. 2. din n = data-in from column n. 3. nop commands are shown for ease of illustration; other commands may be valid at these times. 4. bc4 setting activated by mr0[a1:0 = 10] during write command at t0. 5. the write recovery time (twr) referenced from the first rising clock edge after the last write data shown at t7. twr specifies the last burst write cycle until the precharge command can be issued to the same bank . t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 tn ck# ck dq din n din n+1 din n+2 din n+3 don't care transitioning data t wpre bank, col n notes 2 dqs, dqs# command address notes 3 notes 4 t wpst t wr wl = 5 time break notes 5 figure 45. write (bc4) otf to precharge operation nop write nop nop nop nop nop nop nop nop nop nop notes: 1. bc4 otf, wl = 5 (cwl = 5, al = 0) 2. din n (or b) = data-in from column n. 3. nop commands are shown for ease of illustration; other commands may be valid at these times. 4. bc4 otf setting activated by mr0[a1:0 = 01] and a12 = 0 during write command at t0. 5. the write recovery time (twr) starts at the rising clock edge t9 (4 clocks from t5). t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 ck# ck dq ta0 ta1 ta2 pre nop nop din n din n+1 din n+2 din n+3 don't care transitioning data bank col n valid 4 clocks t wr notes 3 notes 2 address notes 4 command dqs, dqs# t wpre t wpst time break wl = 5 notes 5 1gb auto-as4c64m16d3 confidential --69/86 rev.1.0 june 2015
figure 46. write(bc8) to write(bc8) nop write nop nop write nop nop nop nop nop nop nop notes: 1. bl8, wl = 5 (cwl = 5, al = 0) 2. din n (or b) = data-in from column n (or column b). 3. nop commands are shown for ease of illustration; other commands may be valid at these times. 4. bl8 setting activated by either mr0[a1:0 = 00] or mr0[a1:0 = 01] and a12 = 1 during write command at t0 and t4. 5. the write recovery time (twr) and write timing parameter (twtr) are referenced from the first rising clock edge after the last write data shown at t13. t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 ck# ck dq t12 t13 t14 nop nop nop din n din n+1 din n+2 din n+3 don't care transitioning data bank col n bank col b 4 clocks notes 3 notes 2 address notes 4 command dqs, dqs# t wpre t wpst t ccd din n+4 din n+5 din n+6 din n+7 din b din b+1 din b+2 din b+3 din b+4 din b+5 din b+6 din b+7 t wr t wtr wl = 5 wl = 5 figure 47. write(bc4) to write(bc4) otf nop write nop nop write nop nop nop nop nop nop nop notes: 1. bc4, wl = 5 (cwl = 5, al = 0) 2. din n (or b) = data-in from column n (or column b). 3. nop commands are shown for ease of illustration; other commands may be valid at these times. 4. bc4 setting activated by mr0[a1:0 = 01] and a12 = 0 during write command at t0 and t4. 5. the write recovery time (twr) and write timing parameter (twtr) are referenced from the first rising clock edge at t13 (4 clocks from t9). t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 ck# ck dq t12 t13 t14 nop nop nop din n din n+1 din n+2 din n+3 don't care transitioning data bank col n bank col b 4 clocks notes 3 notes 2 address notes 4 command dqs, dqs# t wpre t wpst t ccd din b din b+1 din b+2 din b+3 t wr t wtr wl = 5 wl = 5 t wpst t wpre figure 48 . write(bc8) to read(bc4,bc8) otf nop write nop nop nop nop nop nop nop nop nop nop notes: 1. rl = 5 (cl = 5, al = 0), wl = 5 (cwl = 5, al = 0) 2. din n = data-in from column n; dout b = data-out from column b. 3. nop commands are shown for ease of illustration; other commands may be valid at these times. 4. bl8 setting activated by either mr0[a1:0 = 00] or mr0[a1:0 = 01] and a12 = 1 during write command at t0. read command at t13 can be either bc4 or bl8 depending on mr0[a1:0] and a12 status at t13. t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 ck# ck dq t12 t13 t14 nop read nop din n din n+1 din n+2 din n+3 don't care transitioning data bank col n bank col b notes 3 notes 2 address notes 4 command dqs, dqs# t wpre din n+4 din n+5 din n+6 din n+7 rl = 5 t wtr wl = 5 t wpst 1gb auto-as4c64m16d3 confidential --70/86 rev.1.0 june 2015
figure 49 . write(bc4) to read(bc4,bc8) otf nop write nop nop nop nop nop nop nop nop nop nop notes: 1. rl = 5 (cl = 5, al = 0), wl = 5 (cwl =5, al = 0) 2. din n = data-in from column n; dout b = data-out from column b. 3. nop commands are shown for ease of illustration; other commands may be valid at these times. 4. bc4 setting activated by mr0[a1:0 = 01] and a12 = 0 during write command at t0. read command at t13 can be either bc4 or bl8 depending on a12 status at t13. t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 ck# ck dq t12 t13 t14 nop read nop din n din n+1 din n+2 din n+3 don't care transitioning data bank col n bank col b notes 3 notes 2 address notes 4 command dqs, dqs# t wpre rl = 5 t wtr wl = 5 t wpst 4 clocks figure 5 0. write(bc4) to read(bc4) nop write nop nop nop nop nop nop nop nop nop read notes: 1. rl = 5 (cl = 5, al = 0), wl = 5 (cwl =5, al = 0) 2. din n = data-in from column n; dout b = data-out from column b. 3. nop commands are shown for ease of illustration; other commands may be valid at these times. 4. bc4 setting activated by mr0[a1:0 = 10]. t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 ck# ck dq t12 t13 t14 nop nop nop din n din n+1 din n+2 din n+3 don't care transitioning data bank col n bank col b notes 3 notes 2 address notes 4 command dqs, dqs# t wpre rl = 5 t wtr wl = 5 t wpst figure 5 1. write(bc8) to write(bc4) otf nop write nop nop write nop nop nop nop nop nop nop notes: 1. wl = 5 (cwl = 5, al = 0) 2. din n (or b) = data-in from column n (or column b). 3. nop commands are shown for ease of illustration; other commands may be valid at these times. 4. bl8 setting activated by mr0[a1:0 = 01] and a12 = 1 during write command at t0. bc4 setting activated by mr0[a1:0 = 01] and a12 = 0 during write command at t4. t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 ck# ck dq t12 t13 t14 nop nop nop din n din n+1 din n+2 din n+3 don't care transitioning data bank col n bank col b notes 3 notes 2 address notes 4 command dqs, dqs# t wpre din n+4 din n+5 din n+6 din n+7 t wtr wl = 5 t wpst t ccd t wr 4 clocks wl = 5 din b din b+1 din b+2 din b+3 1gb auto-as4c64m16d3 confidential --71/86 rev.1.0 june 2015
figure 5 2. write(bc4) to write(bc8) otf nop write nop nop write nop nop nop nop nop nop nop notes: 1. wl = 5 (cwl = 5, al = 0) 2. din n (or b) = data-in from column n (or column b). 3. nop commands are shown for ease of illustration; other commands may be valid at these times. 4. bc4 setting activated by mr0[a1:0 = 01] and a12 = 0 during write command at t0. bl8 setting activated by mr0[a1:0 = 01] and a12 = 1 during write command at t4. t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 ck# ck dq t12 t13 t14 nop nop nop din n din n+1 din n+2 din n+3 don't care transitioning data bank col n bank col b 4 clocks notes 3 notes 2 address notes 4 command dqs, dqs# t wpre t wpst t ccd din b din b+1 din b+2 din b+3 t wr t wtr wl = 5 wl = 5 t wpst t wpre din b+4 din b+5 din b+6 din b+7 figure 5 3. refresh command timing nop ref nop ref nop nop valid valid valid valid valid ref notes: 1. only nop/des commands allowed after refresh command registered until trfc(min) expires. 2. time interval between two refresh commands may be extended to a maximum of 9 x trefi. t0 t1 ta0 ta1 tb0 tb1 tb2 tb3 tc0 ck# ck tc1 tc2 tc3 valid valid valid don't care transitioning data t rfc (min) command t rfc t refi (max. 9 * trefi) dram must be idle dram must be idle time break figure 54 . self-refresh entry/exit timing ck# t1 t2 ta0 tb0 tc0 tc1 td0 teo t0 ck t cksre tf0 t ckesr t xs t xsdll nop sre nop valid nop valid valid odt cke command addr t is don't care time break notes: 1. only nop or des command. 2. valid commands not requiring a locked dll. 3. valid commands requiring a locked dll. t cksrx valid t cpded t is valid srx notes 1 notes 2 valid valid t rp odtl enter self refresh exit self refresh notes 3 1gb auto-as4c64m16d3 confidential --72/86 rev.1.0 june 2015
figure 55 . active power-down entry and exit timing diagram ck# t1 t2 ta0 ta1 tb0 tb1 tc0 t0 ck cke nop valid nop nop nop nop valid t is t ih t is t ih valid valid valid valid t cke t pd t cpded t xp enter power-down mode exit power-down mode address command don't care time break note: valid command at t0 is act, nop, des or pre with still one bank remaining open after completion of the precharge command. figure 56. power-down entry after read and read with auto precharge nop rd or rda nop nop nop nop nop nop nop nop nop nop t0 t1 ta0 ta1 ta2 ta3 ta4 ta5 ta6 ta7 ta8 tb0 ck# ck tb1 valid din b din b+1 din b+2 din b+3 din b+4 din b+5 din b+6 din b+7 t pd t is rl = al + cl don't care transitioning data address cke t cpded valid valid valid command dqs, dqs# dq bl8 din b din b+1 din b+2 din b+3 dq bc4 t rdpden power - down entry time break 1gb auto-as4c64m16d3 confidential --73/86 rev.1.0 june 2015
figure 57 . power-down entry after write with auto precharge nop write nop nop nop nop nop nop nop nop nop nop t0 t1 ta0 ta1 ta2 ta3 ta4 ta5 ta6 ta7 tb0 tb1 ck# ck tb2 nop din b din b+1 din b+2 din b+3 din b+4 din b+5 din b+6 din b+7 wr t is wl = al + cwl don't care transitioning data cke t cpded valid bank, col n valid dq bl8 din b din b+1 din b+2 din b+3 dq bc4 t wrapden power - down entry time break tc0 tc1 nop valid a10 t pd notes: 1. wr is programmed through mr0. start internal precharge dqs, dqs# address command notes 1 figure 58. power-do wn entry after write nop write nop nop nop nop nop nop nop nop nop nop t0 t1 ta0 ta1 ta2 ta3 ta4 ta5 ta6 ta7 tb0 tb1 ck# ck tb2 nop din b din b+1 din b+2 din b+3 din b+4 din b+5 din b+6 din b+7 t wr t is wl = al + cwl don't care transitioning data cke t cpded valid bank, col n valid dq bl8 din b din b+1 din b+2 din b+3 dq bc4 t wrpden power - down entry time break tc0 tc1 nop valid a10 t pd dqs, dqs# address command 1gb auto-as4c64m16d3 confidential --74/86 rev.1.0 june 2015
figure 59 . precharge power-down (fast exit mode) entry and exit ck# t1 t2 ta0 ta1 tb0 tb1 tc0 t0 ck cke nop valid nop nop nop nop valid t is t is t ih valid valid t cke t cpded enter power-down mode exit power-down mode command don't care time break t pd t xp figure 60 . precharge power-down (slow exit mode) entry and exit ck# t1 t2 ta0 ta1 tb0 tb1 tc0 t0 ck cke nop valid nop nop nop nop valid t is t is t ih valid valid t cke t cpded enter power-down mode exit power-down mode command don't care time break t pd t xp td0 valid valid t xpdll 1gb auto-as4c64m16d3 confidential --75/86 rev.1.0 june 2015
figure 61 . refresh command to power-down entry ck# t1 t2 t3 ta0 ta1 t0 ck cke ref valid nop nop valid t is t pd valid t cpded don't care time break t refpden nop valid valid valid address command figure 62 . active command to power-down entry ck# t1 t2 t3 ta0 ta1 t0 ck cke active valid nop nop valid t is t pd valid t cpded don't care time break t actpden nop valid valid valid address command 1gb auto-as4c64m16d3 confidential --76/86 rev.1.0 june 2015
figure 63 . precharge, precharge all command to power-down entry ck# t1 t2 t3 ta0 ta1 t0 ck cke pre or prea valid nop nop valid t is t pd valid t cpded don't care time break t prepden nop valid valid valid address command figure 64 . mrs command to power-down entry ck# t1 ta0 ta1 tb0 tb1 t0 ck cke nop mrs nop valid t is t pd valid t cpded don't care time break t mrspden nop valid valid address command 1gb auto-as4c64m16d3 confidential --77/86 rev.1.0 june 2015
figure 65. synchronous odt timing example ( al = 3; cwl = 5; odtlon = al + cwl - 2 = 6; odtloff = al + cwl - 2 = 6 ) t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 ck# ck t12 t aon (min) odth4, min don't care transitioning data odt al = 3 t13 t14 cke t15 cwl - 2 odtloff = cwl + al - 2 odtlon = cwl + al - 2 dram_rtt t aon (max) t aof (min) t aof (max) rtt_nom al = 3 figure 66. synchronous odt example with bl = 4, wl = 7 nop nop nop nop nop nop nop wrs4 nop nop nop nop t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 ck# ck t12 t13 t14 nop nop nop odth4 don't care transitioning data t15 nop odtloff = wl - 2 dram_rtt odt command cke t16 t17 nop nop odth4min odth4 odtlon = wl - 2 odtlon = wl - 2 odtloff = wl - 2 rtt_nom t aof (min) t aon (max) t aof (max) t aon (min) t aon (max) t aon (min) t aof (min) t aof (max) figure 67 . dynamic odt behavior with odt being asseted before and after the write nop nop nop nop wrs4 nop nop nop nop nop nop nop t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 ck# ck t12 t13 t14 nop nop nop don't care transitioning data t15 nop odt t16 t17 nop nop odth4 odtlon valid rtt din n din n+1 din n+2 din n+3 dq odtloff t adc (min) t adc (max) t aon (min) odth4 odtlcwn4 t aon (max) rtt_nom rtt_wr t adc (min) t adc (max) t aof (min) t aof (max) rtt_nom odtlcnw wl notes: example for bc4 (via mrs or otf), al = 0, cwl = 5. odth4 applies to first registering odt high and to the registration of the write command. in this example, odth4 would be satisfied if odt went low at t8 (4 clocks after the write command). dqs, dqs# command address 1gb auto-as4c64m16d3 confidential --78/86 rev.1.0 june 2015
figure 68. dynamic odt: behavior without write command, al = 0, cwl = 5 valid valid valid valid valid valid valid valid valid valid valid valid t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 ck# ck don't care transitioning data odt odtloff odtlon rtt dq t aon (min) odth4 t aon (max) t adc (min) t adc (max) notes: 1. odth4 is defined from odt registered high to odt registered low, so in this example, odth4 is satisfied. 2. odt registered low at t5 would also be legal. rtt_nom dqs, dqs# address command figure 69 . dynamic odt: behavior with odt pin being asserted together with write command for a duration of 6 clock cycles wrs8 nop nop nop nop nop nop nop nop nop nop nop t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 ck# ck don't care transitioning data odt odtloff odtlcnw rtt dq t aon (min) odth8 t adc (max) t aof (min) t aof (max) notes: example for bl8 (via mrs or otf), al = 0, cwl = 5. in this example, odth8 = 6 is exactly satisfied. rtt_wr valid odtlon odtlcwn8 din b din b+1 din b+2 din b+3 dqs, dqs# address command din b+4 din b+5 din b+6 din b+7 wl 1gb auto-as4c64m16d3 confidential --79/86 rev.1.0 june 2015
figure 70. dynamic odt: behavior with odt pin being asserted together with write com mand for a duration of 6 clock cycles, example for bc4 (via mrs or otf), al = 0, cwl = 5. wrs4 nop nop nop nop nop nop nop nop nop nop nop t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 ck# ck don't care transitioning data odt odtloff odtlcnw rtt dq t aon (min) odth4 t adc (max) t adc (min) t adc (max) notes: 1. odth4 is defined from odt registered high to odt registered low, so in this example, odth4 is satisfied. transitioning don t care 2. odt registered low at t5 would also be legal. valid odtlon odtlcwn4 din n din n+1 din n+2 din n+3 dqs, dqs# address command wl rtt_wr t aof (min) t aof (max) rtt_nom figure 71. dynamic odt: behavior with odt pin being asserted together with write command for a duration of 4 clock cycles wrs4 nop nop nop nop nop nop nop nop nop nop nop t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 ck# ck don't care transitioning data odt odtloff odtlcnw rtt dq t aon (min) odth4 t adc (max) t aof (min) t aof (max) notes: example for bc4 (via mrs or otf), al = 0, cwl = 5. in this example, odth4 = 4 is exactly satisfied. valid odtlon odtlcwn4 din n din n+1 din n+2 din n+3 dqs, dqs# address command wl rtt_wr 1gb auto-as4c64m16d3 confidential --80/86 rev.1.0 june 2015
figure 72. asynchronous odt timings on ddr3 sdram with fast odt transition t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 ck# ck t12 t13 t14 don't care transitioning data t15 t16 t17 rtt t aonpd (min) t aonpd (max) t ih t is t aofpd (min) t aofpd (max) cke odt t ih t is rtt figure 73. synchronous to asynchronous transition during precharge power down (with dll frozen) entry (al = 0; cwl = 5; tanp d = wl - 1 = 4) nop nop nop nop nop nop nop nop nop nop nop t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 ck# ck t12 don't care transitioning data rtt pd entry transition period t cpded t anpd t cpded (min) cke t aof (min) t aof (max) rtt odtloff t aofpd (min) rtt rtt odtloff + t aof (max) odtloff + t aof (min) t aofpd (max) t aofpd (min) rtt pd entry transition period t aofpd (max) rtt first async. odt sync. or async. odt last sync. odt command 1gb auto-as4c64m16d3 confidential --81/86 rev.1.0 june 2015
figure 74. synchronous to asynchronous transition after refresh command (al = 0; cwl = 5; tanpd = wl - 1 = 4) ref nop nop nop nop nop nop nop nop t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 ck# ck t12 don't care transitioning data rtt t rfc (min) t cpded (min) cke t aof (min) t aof (max) rtt odtloff t aofpd (min) rtt odtloff + t aofpd (max) odtloff + t aofpd (min) t aofpd (max) t aofpd (min) pd entry transition period t aofpd (max) rtt t13 ta0 ta1 ta2 ta3 t anpd rtt rtt command last sync. odt sync. or async. odt first async. odt time break figure 75. asynchronous to synchronous transition during precharge power down ( with dll frozen) exit (cl = 6; al = cl - 1; cwl = 5; tanpd = wl - 1 = 9) nop nop nop nop nop nop nop nop nop t0 t1 t2 ta0 ta1 ta2 ta3 ta4 ta5 ta6 tb0 tb1 ck# ck tb2 don't care transitioning data rtt t xpdll t anpd cke t aofpd (min) t aofpd (max) t aofpd (min) rtt odtloff + t aof (max) odtloff + t aof (min) t aofpd (max) t aof (min) pd exit transition period t aof (max) rtt tc0 tc1 tc2 td0 td1 rtt rtt rtt odtloff time break nop nop nop nop nop command last async. odt sync. or async. odt first sync. odt 1gb auto-as4c64m16d3 confidential --82/86 rev.1.0 june 2015
figure 76. transition period for short cke cycles, entry and exit period overlapping (al = 0, wl = 5, tanpd = wl - 1 = 4) t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 ck# ck t12 t anpd don't care cke t13 t14 cke pd exit transition period nop ref nop nop nop nop nop nop nop nop nop nop nop nop nop t rfc (min) pd entry transition period t anpd t xpdll short cke low transition period command t anpd short cke high transition period t xpdll time break figure 7 7. power-down entry,exit clarifications- case 1 ck# t1 t2 ta0 ta1 tb0 t0 ck cke nop valid nop nop t ih t pd t cpded don't care time break nop valid address command tb1 tb2 nop nop t is t ih t is t cpded t is t pd t cke enter power-down mode exit power-down mode enter power-down mode 1gb auto-as4c64m16d3 confidential --83/86 rev.1.0 june 2015
figure 7 8. power-down entry,exit clarifications- case 2 ck# t1 t2 ta0 ta1 tb0 t0 ck cke nop valid nop nop t ih t pd t cpded don't care time break nop valid address command tb1 tc0 nop ref t is t ih t is t xpdll t xp t cke enter power-down mode exit power-down mode enter power-down mode tc1 td0 nop nop figure 79. power-down entry,exit clarifications- case 3 ck# t1 t2 ta0 ta1 tb0 t0 ck cke nop ref nop nop t ih t pd t cpded don't care time break nop tb1 tc0 nop nop t is t ih t is t rfc(min) t xp t cke enter power-down mode exit power-down mode enter power-down mode tc1 td0 nop nop address command 1gb auto-as4c64m16d3 confidential --84/86 rev.1.0 june 2015
figure 80. 96 -ball bga package 9x13x1.2mm(max) outline drawing information pin a1 index detail : "a" top view bottom view side view symbol dimension in inch dimension in mm min nom max min nom max a -- -- 0.047 -- -- 1.20 a1 0.010 -- 0.016 0.25 -- 0.40 a2 0.004 0.006 0.008 0.10 0.15 0.20 d 0.350 0.354 0.358 8.90 9.00 9.10 e 0.508 0.512 0.516 12.90 13.00 13.10 d1 -- 0.252 -- -- 6.40 -- e1 -- 0.472 -- -- 12.00 -- f -- 0.126 -- -- 3.20 -- e -- 0.031 -- -- 0.80 -- b 0.016 0.018 0.020 0.40 0.45 0.50 d2 -- -- 0.081 -- -- 2.05 1gb auto-as4c64m16d3 confidential --85/86 rev.1.0 june 2015
alliance memory, inc. 511 taylor way, san carlos, ca 94070 tel: 650-610-6800 fax: 650-620-9211 www.alliancememory.com copyright ? alliance memory all rights reserved ? copyright 2007 alliance memory, inc. all rights reserved. our three-point logo, our name and intelliwatt are trademarks or registered trademarks of alliance. all other brand and product names may be the trademarks of their respective companies. alliance reserves the right to make changes to this document and its products at any time without notice. alliance assumes no responsibility for any errors that may appear in this document. the data contained herein represents alliance's best data and/or estimates at the time of issuance. alliance reserves the right to change or correct this data at any time, without notice. if the product described herein is under development, significant changes to these specifications are possible. the information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or customer. alliance does not assume any responsibility or liability arising out of the application or use of any product described herein, and disclaims any express or implied warranties related to the sale and/or use of alliance products including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agreed to in alliance's terms and conditions of sale (which are available from alliance). all sales of alliance products are made exclusively according to alliance's terms and conditions of sale. the purchase of products from alliance does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellectual property rights of alliance or third parties. alliance does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of alliance products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify alliance against all claims arising from such use. part numbering system as4c 64m16d3 12 b a n dram 64m16=64mx16 d3=ddr3 12=800mhz b = fbga a=automotive (-40 c105 c) indicates pb and halogen free 1gb auto-as4c64m16d3 confidential --86/86 rev.1.0 june 2015

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